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US$0.08-0.10 / PCS
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$0.10

100-999 PCS US$0.09

1,000+ PCS US$0.08

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Enig
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand UC
  • Transport Package Vacuum Packing
  • Specification IP class -2
  • Trademark Ucreate PCB
  • Origin Shenzhen
  • Board Layer 10L
  • Surface Finihsing Immersion Gold
  • Lead Time 6-8 Working Days

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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PCB Comparison
Transaction Info
Price US $ 0.08-0.10/ PCS US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece
Min Order 1 PCS 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier