| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 1-24;
Base Material Type: Fr4;
Material Finished Thickness: 1.6mm;
Finished Copper: All 1 Oz;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red...;
Screen Color: White/Black/ Red...;
Special: Impedance Control;
PCB Testing: E-Testing; Flying Probe Testing;
Lead Time: 5 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Fr-4tg170//Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Fr-4tg170//Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-210um(6oz);
Service: OEM/ODM, EMS;
Materials: Fr-4/Rogers/Cem1-3/Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
Certificates: ISO9001, IATF16949, ISO13485;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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