| Specification |
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Service: PCB Prototype, Compoments Sourcing, PCB Assembly;
Layer: 1, 2, 4, 6, up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Mc PCB;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
PCB Thickness: 0.3mm-4mm;
PCB Size: 22inch*22inch;
Copper Thickness: 18um-210um(6oz);
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Enig;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
Standard: Ipc-a-610, Ipc-a-620;
Profiling Punching: Routing, V-Cut, Beveling, Chamfer;
SMT Capability: 1206, 0805, 0603, 0402, 0201, 01005;
Test: Ict(in Circuit Test), Fct(Functional Circuit Test;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Service: PCB Prototype, Compoments Sourcing, PCB Assembly;
Layer: 1-32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Mc PCB, Rogers, Isol;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 22inch*22inch or 550mm*550mm;
Surface Finish/Treatment: Hal/HASL Lf, Chemical Tin, Enig, OSP;
Copper Thickness: 18um-210um(6oz);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
Profiling Punching: Routing, V-Cut, Beveling;
Standard: ANSI/ESD, Ipc-a-610, Ipc-a-620;
Placement: Qfp, Sop, Plcc, BGA;
SMT: 1206, 0805, 0603, 0402, 0201, 01005;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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