What is PCB Component Protection and Insulation Silicone Potting Compound
Price
Purchase Qty. Reference FOB Price
1,000-4,999 kg US$4.50
5,000-9,999 kg US$4.30
10,000+ kg US$4.00
Sepcifications
- Application Automobile, Construction, Packing
- Bonding Function Thermal Paste
- Color Gray
- Composition Inorganic Material
- Morphology Curing Glue
- Transport Package Barreled in Carton
- Specification RoHs
- Trademark Volsun
- Origin Jiangsu
- Viscosity (After Mixing)@25 Degrees 5500cps
- Opening Hours @25 Degrees More Than 90 Min
- Curing Conditions 30min/50 Degrees 20min/100 Degrees
- Thermal Conductivity 2.0
- Thermal Resistance 0.000815
- Hardness 25 Shore a
- Density 2.3 g/cm3
- Tensile Strength More Than 0.2 MPa
- Elongation at Break More Than 10%
- Flammability Rating V-0
- Breakdown Strength More Than 10 Kv/mm
- Dielectric Constant (1000Hz) 4.7~5.5
- CAS No. N/a
- Formula N/a
- EINECS N/a
- Material Silicone
- Classification Silicone Glue
- Main Agent Composition Inorganic Adhesive Material
- Characteristic Aging Resistance
- Promoter Composition Curing Agent
Product Description
Product Description VS-TP2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material that cures at room temperature or after heating to form an elastic thermally ...
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