Specification |
Type: Development Board;
Dielectric: Stm32f030c8t6;
Material: Microcontroller;
Application: Learning Board;
Flame Retardant Properties: Small System Board;
Mechanical Rigid: Experimental Board;
Processing Technology: PCB;
Base Material: Arm 32-Bit;
Insulation Materials: Arm System;
Brand: Wonderwing;
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Type: Rigid Circuit Board;
Material: Customise;
Application: Widely;
Mechanical Rigid: Customise;
Base Material: Copper;
Lead Time: 10-30days;
Shipment: Sea or Air;
Quality: UL Approved;
Location: Shenzhen, China;
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Type: Combining Rigid Circuit Board;
Dielectric: N/a;
Material: N/a;
Application: N/a;
Flame Retardant Properties: N/a;
Mechanical Rigid: N/a;
Processing Technology: N/a;
Base Material: N/a;
Insulation Materials: N/a;
Brand: Original;
Shape: DIP/SMD;
Conductive Type: N/a;
Integration: N/a;
Technics: N/a;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1 PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger.OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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