Specification |
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht,Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20,000,000 Points Per Day;
DIP Capability: 300,000 Points Per Day;
|
Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Certificate: ISO/UL/RoHS/CQC/IATF;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Display Size: 10.1~47inch;
Place of Origin: Guangdong, China;
Brand Name: OEM;
Product Name: LCD Controller Board;
Power Supply Voltage: 12VDC+/- 10%;
Board Size: 148X55.1mm;
Screen Voltage: 3.3V/5V/12V;
Resolution: 1920*1080;
Interface: Lvds;
Application: Industrial Application;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Display Size: 10.1~17.3inch;
Place of Origin: Guangdong, China;
Brand Name: OEM;
Product Name: LCD Controller Board;
Power Supply Voltage: 12VDC+/- 10%;
Board Size: 148X55.1mm;
Screen Voltage: 3.3V/5V/12V;
Resolution: 1920*1080;
Interface: Lvds;
Application: Industrial Application;
|
Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Certificate: ISO/UL/RoHS/CQC/IATF;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
|