Bluetooth IoT Remote Support Chip-on-Board RF Medical Devices Cleanroom Embedded Component PCB Assembly Prototyping Automotive Applications PCBA pictures & photos

Bluetooth IoT Remote Support Chip-on-Board RF Medical Devices Cleanroom Embedded Component PCB Assembly Prototyping Automotive Applications PCBA

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Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

Metal Coating Enig / HASL / OSP / Silver etc
Mode of Production SMT / DIP / PCB Manufacturing
Layers From 2 Layers to 50 Layers
Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
Certification RoHS, CCC, ISO
Customized Customized
Condition New
Transport Package UPS/DHL/TNT/EMS/FedEx
Specification Custom
Trademark OEM
Origin China
Solder Mask Color Green,Blue,Yellow,White,Black,Red
Special Process Buried Hole, Blind Hole, Partial High Density, Bac
Copper Thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz
Layer Count 1-50 Layers
Quality Standard Ipc Class 2 and Ipc Class 3

Product Description

Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. HDI ...

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Bluetooth PCB Comparison

	Bluetooth IoT Remote Support Chip-on-Board RF Medical Devices Cleanroom Embedded Component PCB Assembly Prototyping Automotive Applications PCBA Contact Now	Quick View Double-Sided Multi-Layer Custom Medical Expansion Board PCB Assembly Contact Now	Quick View Raspberry Pi Computer Model 3b+ Embedded Board Contact Now	Quick View Raspberry Pi 3b+ Embedded Computer Development Board From The UK Contact Now	Quick View New and Original Raspberry Pi 3b+ Computer Development Board Contact Now

Transaction Info
	Bluetooth IoT Remote Support Chip-on-Board RF Medical Devices Cleanroom Embedded Component PCB Assembly Prototyping Automotive Applications PCBA Contact Now	Quick View Double-Sided Multi-Layer Custom Medical Expansion Board PCB Assembly Contact Now	Quick View Raspberry Pi Computer Model 3b+ Embedded Board Contact Now	Quick View Raspberry Pi 3b+ Embedded Computer Development Board From The UK Contact Now	Quick View New and Original Raspberry Pi 3b+ Computer Development Board Contact Now
Price	US$0.01 / Piece	US$1.00 - 100.00 / Piece	Negotiable	Negotiable	Negotiable
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	-	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC	RoHS, CCC	RoHS, CCC
Management System Certification	-	Others	-	-	-
Trade Capacity
Export Markets	-	North America, Europe, Australia, Domestic	North America, Europe	North America, Europe	North America, Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	-	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Enig / HASL / OSP / Silver etc; Mode of Production: SMT / DIP / PCB Manufacturing; Layers: From 2 Layers to 50 Layers; Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem; Customized: Customized; Condition: New; Solder Mask Color: Green,Blue,Yellow,White,Black,Red; Special Process: Buried Hole, Blind Hole, Partial High Density, Bac; Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz; Layer Count: 1-50 Layers; Quality Standard: Ipc Class 2 and Ipc Class 3;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: Used; Insulation Materials: Organic Resin; Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging; Processing Technology: Electrolytic Foil; Type: Rigid PCB; PCBA Min.IC Pitch: 0.30mm(12mil); BGA Minimum Dia: 01015; PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA; Small Order: Acceptable; IP Protection: Strong Believe in IP Protection with Proven Record;	Metal Coating: Tin; Mode of Production: SMT; Layers: Single-Layer; Base Material: Unknown; Customized: Non-Customized; Condition: New; Processor: Broadcom Bcm2837b0; Memory: 1GB; Environment: Operating Temperature 0–50ºC; Access: 40-Pin Gpio Header; Wireless/Bluetooth: Yes;	Metal Coating: Tin; Mode of Production: SMT; Layers: Single-Layer; Base Material: Unknown; Customized: Non-Customized; Condition: New; Processor: Broadcom Bcm2837b0; Memory: 1GB; Environment: Operating Temperature 0–50ºC; Access: 40-Pin Gpio Header; Wireless/Bluetooth: Yes;	Metal Coating: Tin; Mode of Production: SMT; Layers: Single-Layer; Base Material: Unknown; Customized: Non-Customized; Condition: New; Processor: Broadcom Bcm2837b0; Memory: 1GB; Environment: Operating Temperature 0–50ºC; Access: 40-Pin Gpio Header; Wireless/Bluetooth: Yes;
Supplier Name	Shenzhen Core Hecheng Electronic Technology Co., Ltd.	Shenzhen Jia Cheng Electric Co., Ltd.	CENTURY SOLUTIONS LIMITED	CENTURY SOLUTIONS LIMITED	CENTURY SOLUTIONS LIMITED
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