Specification |
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20, 000, 000 Points Per Day;
DIP Capability: 300, 000 Points Per Day;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Item: Control Board PCBA;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Item: Control Board PCBA;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711, Quad-Core Cortex-A72 (Arm V8) 64;
Memory: 8g;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless;
Environment: Operating Temperature 0–50ºC;
Package List: 1 X Raspberry Pi 4 Model B (2/4/8GB);
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Item: Control Board PCBA;
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