Specification |
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr4;
Surface Finish: HASL;
Printing Ink: Green;
Silk-Screen: White;
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Metal Coating: Cast Iron;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Model No.: Mr-S400;
PCB Tickness: 0.5 ~ 6.0mm;
PCB Weight: ≤5.0kg;
Conveyor Adjustment: Automatic;
Conveyor Height: 900±20mm;
PCB Direction: Left ~ Right(Right ~ Left);
Paste Height: 0 ~ 550um;
Accuracy: Xy (Resolution):10um;
Min Pad Pitch: ≥100um;
Inspection Head Quanlity: 1;
Camera Pixel: 12MP(Optional:5MP/21MP);
Optical Resolution: 5μm/10μm/15μm/20μm;
Fov Size: 20mm*15mm/40mm*30mm/60mm*45mm;
Detection Speed: 0.34s/Fov;
Power: AC200-230,50/60Hz,3kVA;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Thickness: 0.15/0.8/1.0/1.6/2.0/2.4/2.8/3.0/3.2mm;
Inner Copper: 1/2/3/4 Oz;
Finish Copper: 1/2/3/4 Oz;
Surface Finish: Enig/HASL/HASL Lf/OSP;
Solder Mask: Green/White/Red/Orange/Purple;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr4;
Surface Finish: Lf-HASL;
Sodermask: Green;
Silk-Screen: White;
Finish Copper: 1oz;
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