Specification |
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Silver;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: SIC;
Customized: Customized;
Condition: Used;
MOQ: No Required;
Delivery Term: 7-15days;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Processing Technology: Electrolytic Foil;
Flame Retardant Properties: V0;
Material: Polyester Glass Fiber Mat Laminate;
Insulation Materials: Epoxy Resin;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Certificate: UL(Us&Canada). ISO9001. RoHS, Ts, SGS;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Application: LED Driver Circuit Board;
Moisture and Dust Prevention: Comformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
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