Specification |
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized PCB Board;
Condition: New;
Product Name: Customized PCB Board;
Keywords: Electronic Circuit Board;
PCB Portfolio: 1-20 Layers, Standard, HDI, High-Tg, RF Pcbs;
Copper Thickness: 0.5 Oz, 1 Oz, 1.5 Oz, 2 Oz, 3 Oz;
Basic Material: Fr4, Modified Epoxy, Polyimide, PTFE, Glass, Al;
Board Thickness: 0.2-5.0 mm or Customized;
Min. Width/Space: 0.075 mm or Customized;
Min. Sm Bridge: 0.1 mm or Customized;
Min. Hole Dia: 0.1 mm or Customized;
Thickness Tolerance: 8%;
Board Outline Tolerance: 0.15mm;
SMD Pitch: 0.3mm;
Service: One-Stop OEM Service;
Max. Stencial Size: Customized;
Surface Treatment: HASL/OSP/AG/Enig/Enepig/Immersion Silver/Tin;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Aluminium Core PCB;
Customized: Customized;
Condition: New;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Type: PCB Assembly;
Min.Hole Size: 0.12mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Trace Width/Space: 0.075/0.075mm;
Copper Thickness: 1 - 12 Oz;
Assembly Modes: SMT, DIP, Through Hole;
Application Field: LED, Medical, Industrial, Control Board;
Samples Run: Available;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Customized: Customized;
Condition: New;
MOQ: 1 Piece;
Handing Standards: Ipc-a-600h, Ipc-a-610f, J-Std-001f;
Technical Support: Free Dfm/a Check, Bom Analysis;
Assembly Abilities: SMT 5 Milli Points Per Day, DIP 10 Thousands Piec;
Assembly Details: 5 SMT + 2 DIP (Dust and Anti-Static Lines);
5 SMT + 2 DIP (Dust and Anti-Static Lin: PCB Design + PCB Fab + Components Sourcing + PCB;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming, W;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Type: PCB Assembly;
Min.Hole Size: 0.12mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Trace Width/Space: 0.075/0.075mm;
Copper Thickness: 1 - 12 Oz;
Assembly Modes: SMT, DIP, Through Hole;
Application Field: LED, Medical, Industrial, Control Board;
Samples Run: Available;
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