Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Battery Powered PCBA;
Customization: Yes;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Layer: 1-60 Layers;
Description: Printed Circuit Board Assembly;
MOQ: 1PCS;
Best Price: Please Contact Us;
Delivery Time: Sample Is Available Within 3days;
Packaging Details: Inner Package: Vacuum Package+Dryer;
Outer Package: Carton Package+Bulb Package ,Special Packages Requ;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Battery Powered PCBA;
Customization: Yes;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Layer: 1-60 Layers;
Description: Printed Circuit Board Assembly;
MOQ: 1PCS;
Best Price: Please Contact Us;
Delivery Time: Sample Is Available Within 3days;
Packaging Details: Inner Package: Vacuum Package+Dryer;
Outer Package: Carton Package+Bulb Package ,Special Packages Requ;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Battery Powered PCBA;
Customization: Yes;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Layer: 1-60 Layers;
Description: Printed Circuit Board Assembly;
MOQ: 1PCS;
Best Price: Please Contact Us;
Delivery Time: Sample Is Available Within 3days;
Packaging Details: Inner Package: Vacuum Package+Dryer;
Outer Package: Carton Package+Bulb Package ,Special Packages Requ;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Application: Air Cooler;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Insulation Materials: Organic Resin;
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