Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 35um;
Solder Mask: White;
Silkscree: White;
Layer: 1;
Min Hole Size: 0.2mm;
Min Line Spacing: 6mil;
Min Line Width: 6mil;
Certificate: UL, RoHS, SGS, ISO 9001, Ect;
Thermal Conductivity: 4W;
Shipping: UPS, FedEx, DHL, Ect;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Solder Mask: Green;
Surface Finish: HASL, Enig;
Min.Hole Size: 0.25mm;
Min.Line Width: 0.075mm;
Layer: 1 to 18;
Max.Finished Thichness: 0.4~4mm;
Max.Finished Board Side: 500mmx500mm;
Copper Weight: 0.5~4oz;
Certificate: UL, RoHS, SGS, ISO 9001, Ect;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Solder Mask: Green;
Surface Finish: HASL, Enig;
Min.Hole Size: 0.25mm;
Min.Line Width: 0.075mm;
Layer: 1 to 18;
Max.Finished Thichness: 0.4~4mm;
Max.Finished Board Side: 500mmx500mm;
Copper Weight: 0.5~4oz;
Package: Vacuum;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 35um;
Solder Mask: White;
Silkscree: White;
Layer: 1;
Min Hole Size: 0.2mm;
Min Line Spacing: 6mil;
Min Line Width: 6mil;
Certificate: UL, RoHS, SGS, ISO 9001, Ect;
Thermal Conductivity: 4W;
Shipping: UPS, FedEx, DHL, Ect;
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