SCR Power Module Power Module with SCR Control Board Low Cost for Efficient Energy Distribution

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$18.00

1,000+ Pieces US$11.00

Sepcifications

  • Application Power Electronic Components, Temperature Measurement, Hvdc
  • Batch Number 2023+
  • Certification CE
  • Model Inverter, Induction Heating, Chopper, UPS Power
  • Package Epoxy Resin
  • Signal Processing Digital
  • Type SCR
  • Transport Package Plastic
  • Specification 400*300*200
  • Trademark PowerPassion
  • Origin China
  • Mounting Type Standard
  • Description Standard
  • Package / Case Standard
  • Package Type Surface Mount/Through Hole
  • Media Available Datasheet, Photo
  • Configuration Single/Array
  • Current - Breakover Not Applicable
  • Current - Gate Trigger (Igt) (Max) 120mA
  • Current - Hold (Ih) (Max) 800A
  • Current - off State (Max) 35mA
  • Current - on State (It (AV)) (Max) 800A
  • Current - on State (It (RMS)) (Max) 800A
  • Current - Peak Output Standard
  • SCR Type Standard Recovery
  • Warranty 1 Year

Product Description

Product Description High-Power Capability: Discover the zhendi MFC100A SCR Thyristor Module, engineered to handle an astounding current rating reaching up to 800A in its on-state (IT (RMS) and IT (AV)). This makes it an exceptional choice for high-voltage direct current (HVDC) applications, ...

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SCR Control Module Comparison
Transaction Info
Price US $ 11.00-18.00/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification CE RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification - ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Power Electronic Components, Temperature Measurement, Hvdc;
Batch Number: 2023+;
Model: Inverter, Induction Heating, Chopper, UPS Power;
Package: Epoxy Resin;
Signal Processing: Digital;
Type: SCR;
Mounting Type: Standard;
Description: Standard;
Package / Case: Standard;
Package Type: Surface Mount/Through Hole;
Media Available: Datasheet, Photo;
Configuration: Single/Array;
Current - Breakover: Not Applicable;
Current - Gate Trigger (Igt) (Max): 120mA;
Current - Hold (Ih) (Max): 800A;
Current - off State (Max): 35mA;
Current - on State (It (AV)) (Max): 800A;
Current - on State (It (RMS)) (Max): 800A;
Current - Peak Output: Standard;
SCR Type: Standard Recovery;
Warranty: 1 Year;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Logic IC;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Package: BGA;
Signal Processing: Digital;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2023;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Structure: Multilayer Rigid PCB;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Structure: Multilayer Rigid PCB;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Supplier Name

Zhenjiang Zhendi Electric Technology Co., Ltd

Gold Member

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier