Amplifier Control Boards
US$0.58 - 3.58 / Piece

Expert in Automotive Audio Processing PCBA Custom DSP & Amplifier Control Boards Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$3.58

100-999 Pieces US$1.58

1,000+ Pieces US$0.58

Sepcifications

  • Metal Coating Copper/Tin/Gold/Silver/HASL/OSP/Enig
  • Mode of Production SMT,DIP
  • Layers Multilayer
  • Base Material Fr4,High-Tg Fr4,Cem3,Aluminum,High Frequency(Roger
  • Certification RoHS, CCC
  • Customized Customized
  • Condition New
  • Transport Package ESD Bag+Bubble Wrapped +Carton
  • Specification Customize
  • Origin China
  • Layer Counts 1--58L
  • Material Thickness(mm) 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4
  • Max Board Size(mm) 1200X400mm
  • Board Outline Tolerance ±0.15mm
  • Board Thickness 0.4mm--3.2mm
  • Thickness Tolerance ±8%
  • Minimum Line/Space 0.1mm
  • Min Annular Ring 0.1mm
  • SMD Pitch 0.3mm
  • Min Hole Size(Mechanical) 0.2mm
  • Min Hole Size(Laser Hole) 0.1mm
  • Hole Size Tol (+/-) Pth:±0.075mm;Npth: ±0.05mm
  • Hole Position Tol ±0.075mm
  • HASL/Lf Hal 2.5um
  • Copper Weight 0.5--6oz

Product Description

PCB Specification: Layer Counts 1--58L Base Material FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) Material Thickness(mm) 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 Max board size(mm) 1200x400mm Board Outline Tolerance ±0.15mm Board Thickness 0.4mm--3.2mm ...

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Amplifier Control Boards Comparison
Transaction Info
Price US$0.58 - 3.58 / Piece US$0.10 / Piece US$0.50 - 1.00 / Piece US$0.50 - 1.00 / Piece US$250.00 - 600.00 / Set
Min Order 1 Piece 100 Pieces 10 Pieces 10 Pieces 1 Piece
Payment Terms T/T LC, T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T
Quality Control
Product Certification RoHS, CCC - RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - - - - -
Trade Capacity
Export Markets Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Oceania, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT,DIP;
Layers: Multilayer;
Base Material: Fr4,High-Tg Fr4,Cem3,Aluminum,High Frequency(Roger;
Customized: Customized;
Condition: New;
Layer Counts: 1--58L;
Material Thickness(mm): 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4;
Max Board Size(mm): 1200X400mm;
Board Outline Tolerance: ±0.15mm;
Board Thickness: 0.4mm--3.2mm;
Thickness Tolerance: ±8%;
Minimum Line/Space: 0.1mm;
Min Annular Ring: 0.1mm;
SMD Pitch: 0.3mm;
Min Hole Size(Mechanical): 0.2mm;
Min Hole Size(Laser Hole): 0.1mm;
Hole Size Tol (+/-): Pth:±0.075mm;Npth: ±0.05mm;
Hole Position Tol: ±0.075mm;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6oz;
Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Power Input: 3kw/4kw/5kw/6kw/7kw/8kw/10kw/12kw/15kw/18kw/25kw;
Power Type: AC/DC Hybrid;
Rated Voltage: Three Phase AC380V, Single Phase AC220V;
Heat-Dissipating Method: Air Cooling, Liquid Cooling;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Method: RS485;
Refrigerant: R410;R32;R290;
Function: Cooling, Heating, Hot Water, Solar Power;
Remote Control: WiFi, APP;
Interaction: Touch Screen, Touch Button;
Supplier Name

Hangzhou Udwells Technology Co., Ltd.

Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

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Mu Star (shenzhen) Industry Co., Ltd.

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Mu Star (shenzhen) Industry Co., Ltd.

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Guangzhou Asl Electronic Technology Co., Ltd.

Diamond Member Audited Supplier