| Specification |
Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT,DIP;
Layers: Multilayer;
Base Material: Fr4,High-Tg Fr4,Cem3,Aluminum,High Frequency(Roger;
Customized: Customized;
Condition: New;
Layer Counts: 1--58L;
Material Thickness(mm): 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4;
Max Board Size(mm): 1200X400mm;
Board Outline Tolerance: ±0.15mm;
Board Thickness: 0.4mm--3.2mm;
Thickness Tolerance: ±8%;
Minimum Line/Space: 0.1mm;
Min Annular Ring: 0.1mm;
SMD Pitch: 0.3mm;
Min Hole Size(Mechanical): 0.2mm;
Min Hole Size(Laser Hole): 0.1mm;
Hole Size Tol (+/-): Pth:±0.075mm;Npth: ±0.05mm;
Hole Position Tol: ±0.075mm;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6oz;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
RAM: 1GB Lpddr2 Sdram;
Emmc: 16GB;
Processor: Broadcom Bcm2837b0;
Other: Cortex-A53 (Armv8) 64-Bit Soc @ 1.2GHz;
Application: IoT/Ai;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
RAM: 1GB Lpddr2 Sdram;
Emmc: Lite;
Processor: Broadcom Bcm2837b0;
Other: Cortex-A53 (Armv8) 64-Bit Soc @ 1.2GHz;
Application: IoT/Ai;
|
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
RAM: 1GB Lpddr2 Sdram;
Emmc: 32GB;
Processor: Broadcom Bcm2837b0;
Other: Cortex-A53 (Armv8) 64-Bit Soc @ 1.2GHz;
Application: IoT/Ai;
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