251277 items found for cheap motor circuit . Buy cheap & discount motor circuit directly from reliable China wholesalers.
Metal Coating:
Copper
Mode of Production:
SMT
Layers:
Single-Layer
Base Material:
FR-4
Customized:
Customized
Condition:
New
Metal Coating:
Copper
Mode of Production:
SMT
Layers:
Double-Layer
Base Material:
FR-4
Certification:
RoHS, CCC, ISO
Customized:
Customized
Conductive Type:
N/a
Integration:
N/a
Technics:
N/a
shape:
DIP/SMD
Packing:
N/a
Standard:
DIP/SMD
After-sales Service:
2 Years
Warranty:
2 Years
Rated Current Range:
1 (0.1A-5000A)
Power Supply:
AC85-265V/DC100-350V
Rated Working Voltage:
AC220V / 380V / 660V, 50Hz / 60Hz
Communication:
4-20mA Analog Output
Display:
LCD
Current Range:
6.3-25A
Voltage:
380V
Motor Power:
3-11kw
Power Supply for Motor Protector:
AC85V~265V/DC100V~350V
Power Supply for Motor:
AC380V/AC660V, 50h/60Hz
Theory:
Time Relay
Usage:
Communication Relay
Electricity Type:
Ac
Type:
Time Delay
Lead Time:
3-4 Days
Amperage Rating:
3A
Packing:
Box Packaging
Standard:
TT motor
Trademark:
WONDERWING
Origin:
China
Manufacturing Technology:
Integrated Circuits Device
Material:
Element Semiconductor
Type:
N-type Semiconductor
Signal Processing:
Digital
Application:
Motor Driver
Model:
Sn
Manufacturing Technology:
Integrated Circuits Device
Material:
Element Semiconductor
Type:
N-type Semiconductor
Package:
PGA(Pin Grid Array Package)
Signal Processing:
Digital
Application:
Motor Driver
Product Number:
A4989sldtr-T
Description:
IC Mtr Drv Bipolr 3-5.5V 38tssop
Category:
Motor Drivers
Base Product Number:
A4989
Voltage - Output (Min/Fixed):
0.6V
Mounting Type:
Surface Mount
Manufacturing Technology:
Integrated Circuits Device
Material:
Element Semiconductor
Type:
N-type Semiconductor
Package:
PGA(Pin Grid Array Package)
Signal Processing:
Digital
Application:
Motor Driver
Condensation Forms:
Water-Cooled
Refrigerant:
R717
Type:
Evaporative Condenser
Material:
Stainless Steel
Structural Form:
Vertical
Heat Transfer Mode:
Evaporative Type
Structure:
Metal Base Rigid PCB
Dielectric:
Aluminum
Material:
Metal
Application:
Consumer Electronics
Flame Retardant Properties:
V0
Processing Technology:
Electrolytic Foil
Automation:
Semi-automatic
Clean Type:
Clean-In-Place
Cleaning Process:
Cold Water Cleaning
Control:
Artificial
Customized:
Customized
Fuel:
Electric
Certification:
RoHS, CE, ISO
Function:
Switch Transistor
Structure:
Planar
Encapsulation Structure:
plug-in unit
Material:
Silicon
Features1:
current transducer using the Holl effect
shape:
DIP
Conductive Type:
Unipolar Integrated Circuit
Integration:
GSI
Technics:
Semiconductor IC
Packing:
Standard Package
Standard:
0.216935 oz
Conductive Type:
Bipolar Integrated Circuit
shape:
Flat
Packing:
Original
Port:
Shenzhen
Production Capacity:
10000pics/Months
Trademark:
NXP USA Inc.
Conductive Type:
Bipolar Integrated Circuit
shape:
Flat
Packing:
Original
Port:
Shenzhen
Production Capacity:
10000pics/Months
Trademark:
NXP USA Inc.
shape:
DIP
Conductive Type:
Unipolar Integrated Circuit
Integration:
GSI
Technics:
Semiconductor IC
Packing:
Standard Package
Port:
Shenzhen
Conductive Type:
Bipolar Integrated Circuit
shape:
Flat
Packing:
Tape & Reel (Tr)
Port:
Shenzhen
Production Capacity:
10000pics/Months
Origin:
Original
Conductive Type:
Bipolar Integrated Circuit
shape:
Flat
Packing:
Original
Port:
Shenzhen
Production Capacity:
10000pics/Months
Trademark:
NXP USA Inc.
Conductive Type:
Bipolar Integrated Circuit
shape:
Flat
Packing:
Tape & Reel (Tr)
Port:
Shenzhen
Production Capacity:
10000pics/Months
Origin:
Original
Conductive Type:
Bipolar Integrated Circuit
shape:
Flat
Packing:
Original
Port:
Shenzhen
Production Capacity:
10000pics/Months
Origin:
Original
Conductive Type:
Bipolar Integrated Circuit
shape:
Flat
Packing:
Original
Port:
Shenzhen
Production Capacity:
10000pics/Months
Origin:
Original
Metal Coating:
Tin
Mode of Production:
SMT
Layers:
Double-Layer
Base Material:
FR-4
Certification:
RoHS, CCC
Customized:
Customized
Dielectric:
Alu.
Board Thickness:
1.7mm
Copper Thickness:
1oz
Test:
Flying Probe & Fixture
Solder Mask Type:
White
Min.Line Width/Space:
0.2mm
shape:
DIP
Conductive Type:
Unipolar Integrated Circuit
Integration:
GSI
Technics:
Thick Film IC
Date Code:
2021+
Brand:
Diodes
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Element Semiconductor
Type:
N-type Semiconductor
Package:
PGA(Pin Grid Array Package)
Signal Processing:
Analog Digital Composite and Function
Application:
Temperature Measurement
shape:
DIP
Conductive Type:
Unipolar Integrated Circuit
Integration:
GSI
Technics:
Thick Film IC
Date Code:
2021+
Brand:
Toshiba
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Element Semiconductor
Type:
N-type Semiconductor
Package:
PGA(Pin Grid Array Package)
Signal Processing:
Analog Digital Composite and Function
Application:
Wind-Power Converters,UPS,Traction
shape:
DIP
Conductive Type:
Unipolar Integrated Circuit
Integration:
GSI
Technics:
Thick Film IC
Date Code:
2021+
Bank:
Analog Devices Inc./Maxim Integrated
Structure:
Single-Sided FPC
Material:
Silver Paste
Combination Mode:
Adhesive Flexible Plate
Application:
Digital Products, Aviation and Aerospace, Medical Device
Flame Retardant Properties:
V0
Processing Technology:
Printing
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Element Semiconductor
Type:
N-type Semiconductor
Package:
PGA(Pin Grid Array Package)
Signal Processing:
Analog Digital Composite and Function
Application:
Temperature Measurement
shape:
DIP
Conductive Type:
Unipolar Integrated Circuit
Integration:
GSI
Technics:
Thick Film IC
Date Code:
2021+
Brand:
Analog Devices Inc.
Metal Coating:
Copper
Mode of Production:
SMT
Layers:
Single-Layer
Base Material:
FR-4
Customized:
Customized
Condition:
New
Dielectric:
Alu.
Board Thickness:
1.7mm
Copper Thickness:
1oz
Test:
Flying Probe & Fixture
Solder Mask Type:
White
Min.Line Width/Space:
0.2mm
shape:
Standard
Conductive Type:
Standard
Integration:
Standard
Technics:
Semiconductor IC
Packing:
Standard
Standard:
standard
shape:
Standard
Conductive Type:
Standard
Integration:
Standard
Technics:
Semiconductor IC
Packing:
Standard
Standard:
standard
shape:
Standard
Conductive Type:
Standard
Integration:
Standard
Technics:
Semiconductor IC
Packing:
Standard
Standard:
standard
shape:
Standard
Conductive Type:
Standard
Integration:
Standard
Technics:
Semiconductor IC
Packing:
Standard
Standard:
standard
shape:
Standard
Conductive Type:
Standard
Integration:
Standard
Technics:
Semiconductor IC
Packing:
Standard
Standard:
standard
shape:
Standard
Conductive Type:
Standard
Integration:
Standard
Technics:
Semiconductor IC
Packing:
Standard
Standard:
standard
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Compound Semiconductor
Type:
Unipolar Integrated Circuit
Package:
DIP(Dual In-line Package)
Signal Processing:
Digital
Batch Number:
2010+
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Compound Semiconductor
Type:
Unipolar Integrated Circuit
Package:
DIP(Dual In-line Package)
Signal Processing:
Digital
Batch Number:
2010+
After-sales Service:
Free Accessories
Warranty:
1 Year Warranty
Output Type:
AC Single Phase
Starting:
Electric Start
Phase:
Single-Phase
Power:
<5kW
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Compound Semiconductor
Type:
Unipolar Integrated Circuit
Package:
DIP(Dual In-line Package)
Signal Processing:
Digital
Batch Number:
2023
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Compound Semiconductor
Package:
DIP(Dual In-line Package)
Signal Processing:
Digital
Batch Number:
2023
Series:
Kintex®-7
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Compound Semiconductor
Type:
Unipolar Integrated Circuit
Package:
DIP(Dual In-line Package)
Signal Processing:
Digital
Batch Number:
2010+
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