Thermal Pad (UTP100)
![]() Thermal Pad (UTP100) |
Product Description
Features and Benefits:
-Thermal Conductivity: 1.0 W/m. K
-Fiberglass reinforced for puncture, shear and tear resistance
-High conformability
-Electrically insulating
-Easy to assembly
Typical Applications:
-Notebook computers
-Telecommunication hardware
-Handheld microprocessor devices
-Servers and desktop computers
-RDSAM Memory modules
-Power supply &signal amplifier
-Flat panel displays
-Audio and video components
-LCD TV and LED lighting
Configurations:
-Available with or without adhesive
-Standard sheet size: 200*400mm
-Custom Die-cut parts available
| Typical Properties of UTP100 | |||
| Properties | Units | Metric Value | Test Method |
| Construction & Composition | ---- | Silicone & Fiberglass | ---- |
| Color | ---- | pink & white | Visual |
| Thickness Range | mm | 0.5~6.0 | ---- |
| Hardness | Shore C | 10 | ASTM D2240 |
| Density | g/cc | 2.0 | ASTM D792 |
| Tensile Strength | KN/m | 2.5 | ASTM D412 |
| Elongation | % | 60% | ASTM D412 |
| Continuous Use Temp | ºC | -40 to 150 | EN344 |
| Breakdown Voltage | Kv/mm | ≥ 6.0 | ASTM D149 |
| Volume Impedance | ohm-cm | 6.2*10 15 | ASTM D257 |
| Dielectric Constant | 1MHz | 5.27 | ASTM D150 |
| Weight Daminify | ---- | ≤1% | @150 ºC 240H |
| Flame Rating | ---- | V-0 | UL 94 |
| Thermal Conductivity | W/m.k | 1.0 | ASTM E1461 |
More Product Features
| Trademark: | AOK |
|---|---|
| Model NO.: | UTP100 |
| Standard: | 200*400 |
| Productivity: | 5000, 000pcs/year |
| Unit Price: | US $ 8.00/ 200 |
| Shipment Terms: | FOB |
| Company: | Shenzhen Aok Technology Co., Ltd. |
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