Min. Order Reference FOB Price
1 Piece US$100,000.00-1,000,000.00 / Piece
Product Description
Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches (8-inch kit optional) X/Y/θ ±0.035mm,≤±3° UPH 4-8K ...