Semiconductor High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

  • After-sales Service Provided
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification ISO
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Transport Package Customized or Wooden Box Packaging
  • Specification Standard Specifications
  • Trademark Himalaya
  • Origin China
  • Product Name Semiconductor Equipment
  • Feature 1 Guaranteed Quality
  • Feature 2 Customized According to Needs
  • After-Sale Service Provided

Product Description

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches (8-inch kit optional) X/Y/θ ±0.035mm,≤±3° UPH 4-8K ...

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Die Bonder Comparison
Transaction Info
Price US $ 100,000.00-1,000,000.00/ Piece US $ 18.00-28.00/ Piece US $ 18.00-25.00/ Piece US $ 22.00-28.00/ Piece US $ 920/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union, Paypal
Quality Control
Product Certification ISO ISO, CE CCC, ISO ISO, CE -
Management System Certification - ISO 9001, ISO 9000 ISO 9001, ISO 9000 ISO 9001, ISO 9000 ISO 9001, ISO 9000
Trade Capacity
Export Markets Europe North America, South America, Europe North America, South America, Europe North America, South America, Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Others OEM, ODM, Own Brand, Others OEM, ODM, Own Brand, Others OEM, ODM, Own Brand, Others Own Brand
Average Lead Time Off-season: 1-3 Month(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
After-sales Service: Provided;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Product Name: Semiconductor Equipment;
Feature 1: Guaranteed Quality;
Feature 2: Customized According to Needs;
After-Sale Service: Provided;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Stock: Yes;
MOQ: 1 Piece;
Package: Standard Package;
Delivery: 10-15 Working Days;
Payment: 100% T/T Advance;
Apply to: SMT Machine;
Condition: New;
Warranty: 6 Months;
Automatic Grade: Automatic;
Stock: Yes;
Heating System: Electric;
Customized: Non-Customized;
MOQ: 1 Piece;
Stocks: Stocks;
Delivery: 10-15 Working Days;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Stock: Yes;
Payment: 100% Advance;
Condition: New;
Speed: High Speed;
Production Scope: Product Line;
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

China Supplier - Gold Member Audited Supplier

Guangdong Juguangheng Automation Equipment Co., Ltd.

China Supplier - Gold Member Audited Supplier

Guangdong Juguangheng Automation Equipment Co., Ltd.

China Supplier - Gold Member Audited Supplier

Guangdong Juguangheng Automation Equipment Co., Ltd.

China Supplier - Gold Member Audited Supplier

Qinyi Electronics Co., Ltd.

China Supplier - Gold Member Audited Supplier