Factory Direct Sales Fully Automatic High-Precision Semiconductor Wafer Laser Grooving Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$550,000.00-1,000,000.00 / Piece

Sepcifications

  • After-sales Service Provided
  • Function Laser Grooving
  • Demoulding No
  • Condition New
  • Certification ISO
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Installation Vertical
  • Driven Type Electric
  • Mould Life Laser Warranty for One Year
  • Transport Package Complies with International Logistics Standards
  • Specification 1400 x2400x 2440 (including tricolor light)
  • Trademark Himalaya
  • Origin China
  • Product Name Wafer Laser Grooving
  • Feature 1 Guaranteed Quality
  • Feature 2 Customized According to Needs
  • OEM/ODM Service Provided

Product Description

This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates high-performance, high-power, and ultra fast lasers, providing long-term stable and ...

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Laser Grooving Comparison
Transaction Info
Price US $ 550,000.00-1,000,000.00/ Piece US $ 10,000.00-15,000.00/ Set US $ 1,499.00-5,000.00/ Piece US $ 2,999.00-5,999.00/ Piece US $ 1,499.00-5,000.00/ Piece
Min Order 1 Pieces 1 Sets 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T T/T T/T, Paypal T/T
Quality Control
Product Certification ISO - - - -
Management System Certification - ISO 9001, EICC ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model Others - OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: 1-3 Month(s)
Peak-season: 1-3 Month(s)
- Off-season: within 15 Day(s)
Peak-season: 6-12 Month(s)
Off-season: within 15 Day(s)
Peak-season: 6-12 Month(s)
Off-season: within 15 Day(s)
Peak-season: 6-12 Month(s)
Product Attributes
Specification
After-sales Service: Provided;
Function: Laser Grooving;
Demoulding: No;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Electric;
Mould Life: Laser Warranty for One Year;
Product Name: Wafer Laser Grooving;
Feature 1: Guaranteed Quality;
Feature 2: Customized According to Needs;
OEM/ODM Service: Provided;
Max. PCB Size (X X Y): 510mm X 460mm;
Min. PCB Size (Y X X): 50mm X 50mm;
Fov: 36mm X 30mm;
Resolution: +/-15 Micron;
Lighting System: Multi-Angle Surrounding LED Light Source;
Inspecting Contents: Missing Parts, Misalignment, Tilted Feet, Virtual;
Software: Owned Design;
Max. Bottom Gap: 50 mm;
Delivery Speed: 1500mm/S (Max);
Model Number: Sr-B30p;
Control System: PLC;
Length Accuracy: Cutting Length ±1%;
Trip: 30mm;
Cutting Diameter: 220V 50-60Hz;
Cutting Way: Motor Cutting;
Power: 300W;
Cutting Speed: 10-60PCS/Min (Depend on The Length);
Model Number: Sr-B30p;
Control System: PLC;
Length Accuracy: Cutting Length ±1%;
Trip: 30mm;
Cutting Diameter: 220V 50-60Hz;
Cutting Way: Motor Cutting;
Power: 300W;
Cutting Speed: 10-60PCS/Min (Depend on The Length);
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen HTGD Intelligent Equipment Co., Ltd.

China Supplier - Gold Member Audited Supplier

Sinrad Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Sinrad Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Sinrad Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier