Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder for Semiconductor Packaging Machine pictures & photos

Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder for Semiconductor Packaging Machine

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Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

After-sales Service Provided
Condition New
Speed High Speed
Precision High Precision
Certification ISO
Warranty 12 Months
Automatic Grade Automatic
Transport Package Customized or Wooden Box Packaging
Specification Standard Specifications
Trademark Himalaya
Origin China
Product Name Semiconductor Equipment
Feature 1 Guaranteed Quality
Feature 2 Customized According to Needs
After-Sale Service Provided

Product Description

Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip size 0.2mmx0.2mm~2.3mmx2.3mm Wafer size 3~8 inches (with 8-inch work frame) ...

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Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Number of Employees 11
Year of Establishment 2019-09-12
Plant Area 83 square meters
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder for Semiconductor Packaging Machine Contact Now	Siemens 03041671 Original Tape Feeder Module 16mm Xfs06 Lid Foildisposal X16 for Chip Contact Now	Quick View Neoden 4 High Precise Desktop PCB Mounting Chip Mounter SMT SMD Pick and Place Machine for LED Assembly Line Contact Now	Quick View Neoden 4 LED SMT SMD Pick and Place Mini Machine Desktop High Precise with Internal Rail Contact Now	Quick View Neoden 4 Heads PCB Manufacturing Equipment BGA SMT Mounting Pick and Place Machine Contact Now

Transaction Info
	Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder for Semiconductor Packaging Machine Contact Now	Siemens 03041671 Original Tape Feeder Module 16mm Xfs06 Lid Foildisposal X16 for Chip Contact Now	Quick View Neoden 4 High Precise Desktop PCB Mounting Chip Mounter SMT SMD Pick and Place Machine for LED Assembly Line Contact Now	Quick View Neoden 4 LED SMT SMD Pick and Place Mini Machine Desktop High Precise with Internal Rail Contact Now	Quick View Neoden 4 Heads PCB Manufacturing Equipment BGA SMT Mounting Pick and Place Machine Contact Now
Price	US $ 100,000.00-1,000,000.00/ Piece	US $ 35.00-55.00/ Piece	US $ 7499/ Set	US $ 7499/ Set	US $ 7499/ Set
Min Order	1 Pieces	1 Pieces	1 Sets	1 Sets	1 Sets
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Paypal, Money Gram	T/T, Paypal, Money Gram	T/T, Paypal, Money Gram
Quality Control
Product Certification	ISO	CCC, PSE, FDA, RoHS, ISO, CE	CE	CE	CE
Management System Certification	-	BSCI, ASME	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets	Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Others	-	ODM, Own Brand	ODM, Own Brand	ODM, Own Brand
Average Lead Time	Off-season: 1-3 Month(s) Peak-season: 1-3 Month(s)	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Video Technical Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Delivery: 1-7 Days; MOQ: 1 PC; Quality: 100% Tested; Adaptation: SMT Placement Machine; Inventory: Availability;	After-sales Service: 2 Years; Condition: New; Speed: Medium Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Feeder Qty for Tape Reel: 48; Vibration Feeder Qty for Tube IC: 5; Tray IC Capacity: 45; Tape Width: 8/12/16/24mm; Components: 0201,BGA,Soic,Ssop, Qfn,Tqfp,LED; Height Max: 5mm; Placement Area: 310X400mm Without Tray, 140X400 with 1 Waffle; Power Supply: 110/220V, 50Hz,180W; Placement Head Qty: 4PCS; Packing Size: 94X74X60cm;	Condition: New; Speed: Medium Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Feeder Qty for Tape Reel: 48; Vibration Feeder Qty for Tube IC: 5; Tray IC Capacity: 45; Tape Width: 8/12/16/24mm; Components: 0201,BGA,Soic,Ssop, Qfn,Tqfp,LED; Height Max: 5mm; Placement Area: 310X400mm Without Tray, 140X400 with 1 Waffle; Power Supply: 110/220V, 50Hz,180W; Placement Head Qty: 4PCS; Packing Size: 94X74X60cm;	After-sales Service: 2 Years; Condition: New; Speed: Medium Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Feeder Qty for Tape Reel: 48; Vibration Feeder Qty for Tube IC: 5; Tray IC Capacity: 45; Tape Width: 8/12/16/24mm; Components: 0201,BGA,Soic,Ssop, Qfn,Tqfp,LED; Height Max: 5mm; Placement Area: 310X400mm Without Tray, 140X400 with 1 Waffle; Power Supply: 110/220V, 50Hz,180W; Placement Head Qty: 4PCS; Packing Size: 94X74X60cm;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Guangdong Xinling Industrial Co., Ltd	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.
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