PCB Assembly
US$2.00 / Piece
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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$2.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Immersion Gold
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Transport Package Box
  • Trademark hemeixin
  • Origin China
  • Copper Thickness 3oz -105oz
  • Surface Finish Gold Finger
  • Special Teck Metal Edging
  • Special 1 Blind Hole
  • Special 2 Buried Vias
  • Special 3 Flex-Rigid PCB

Product Description

Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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PCB Assembly Comparison
Transaction Info
Price US $ 2/ Piece US $ 1.00-12.00/ pcs US $ 1.00-12.00/ pcs US $ 1.00-12.00/ pcs US $ 1.00-12.00/ pcs
Min Order 1 Pieces 1 pcs 1 pcs 1 pcs 1 pcs
Trade Terms - FOB, CFR, CIF, EXW FOB, CFR, CIF, EXW FOB, CFR, CIF, EXW FOB, CFR, CIF, EXW
Payment Terms L/C, T/T, Western Union T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485
Trade Capacity
Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Washing Machine PCB Board, PCBA Assembly Project O;
Layer: 1-18;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: 94V0 Printed Circuit PCB Board;
Layer: 1-18;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Electronics Mainboard;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Android Mobile Phone PCB Board;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Supplier Name

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen STHL Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen STHL Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen STHL Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen STHL Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier