Advanced PCB for Telecommunications Infrastructure with Heavy Copper PCB Construction PCB Circuit Assembly Video

Name: Advanced PCB for Telecommunications Infrastructure with Heavy Copper PCB Construction PCB Circuit Assembly
Uploaded: 2024-05-06T15:41:14+08:00
Description: Product Description Heavy copper PCBs find applications in various industries, including power electronics, automotive, aerospace, industrial equipment, and renewable energy systems. They are c

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-1.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Immersion Gold
Base Material Fr4
Insulation Materials Epoxy Resin
Transport Package Box
Trademark hemeixin
Origin China
Copper Thickness 3oz -105oz
Surface Finish Gold Finger
Special Teck Metal Edging
Special 1 Blind Hole
Special 2 Buried Vias
Special 3 Flex-Rigid PCB

Product Description

Product Description Heavy copper PCBs find applications in various industries, including power electronics, automotive, aerospace, industrial equipment, and renewable energy systems. They are commonly used in devices such as power supplies, motor controllers, battery management systems, ...

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Shenzhen Hemeixin Electronic Co., Limited

Diamond Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, Cables, PCBA
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Quick View Advanced PCB for Telecommunications Infrastructure with Heavy Copper PCB Construction PCB Circuit Assembly Contact Now	Quick View HASL Immersion Gold Circuit Double-Sided Fr-4 SMT PCB Mainboard China Contact Now	Quick View Quick Turn Prototype Original Component Sourcing PCB Motherboard PCBA for Heat Pump/ Fan in China Contact Now	Quick View Multilayer Printed Circuit Board Professional Electronics PCB Manufacturing Solutions Contact Now	Quick View Custom Single/Double/Multilayer Printed Circuit Board Prototype PCB Solutions Contact Now

Transaction Info
	Quick View Advanced PCB for Telecommunications Infrastructure with Heavy Copper PCB Construction PCB Circuit Assembly Contact Now	Quick View HASL Immersion Gold Circuit Double-Sided Fr-4 SMT PCB Mainboard China Contact Now	Quick View Quick Turn Prototype Original Component Sourcing PCB Motherboard PCBA for Heat Pump/ Fan in China Contact Now	Quick View Multilayer Printed Circuit Board Professional Electronics PCB Manufacturing Solutions Contact Now	Quick View Custom Single/Double/Multilayer Printed Circuit Board Prototype PCB Solutions Contact Now
Price	US $ 0.10-1.00/ Piece	US $ 1.00-5.00/ Piece	US $ 1.00-5.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	-	RoHS, UL / ISO9001, ISO13485, IATF16949	RoHS, UL / ISO9001, ISO13485, IATF16949	-	-
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025	ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics, Communications, Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Basic Material: Fr-4; PCBA Testing: X-ray, Aoi Test, Function Test; PCBA Min. BGA Pitch: 0.3mm; Other Service: ODM, OEM, Final Product Assembling; PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics, Communications, Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Basic Material: Fr-4; PCBA Testing: X-ray, Aoi Test, Function Test; PCBA Min. BGA Pitch: 0.3mm; Other Service: ODM, OEM, Final Product Assembling; PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: EEG;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: EEG;
Supplier Name	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Grandtop Electronics Co., Ltd.	Shenzhen Grandtop Electronics Co., Ltd.	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED
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