PCB Assembly
US$0.10-1.00 / Piece
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Gold Finger High-Quality SMT DIP Assembly Circuit Board PCBA for LED Lighting Fixtures with SMT Components Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-1.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Immersion Gold
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Transport Package Box
  • Trademark hemeixin
  • Origin China
  • Copper Thickness 3oz -105oz
  • Surface Finish Gold Finger
  • Special Teck Metal Edging
  • Special 1 Blind Hole
  • Special 2 Buried Vias
  • Special 3 Flex-Rigid PCB

Product Description

Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.10-1.00/ Piece US $ 2.00-5.00/ Piece US $ 2.00-5.00/ Piece US $ 0.10-100.00/ Square Meter US $ 0.10-100.00/ Square Meter
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Square Meters 1 Square Meters
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union T/T, Western Union, Paypal T/T, Western Union, Paypal Online transactions Online transactions
Quality Control
Management System Certification ISO 9001 - - - -
Trade Capacity
Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Europe, East Asia(Japan/ South Korea) North America, Europe, East Asia(Japan/ South Korea) Domestic Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM - - - -
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Supplier Name

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Finest Pcb Assembly Limited

China Supplier - Diamond Member Audited Supplier

Finest Pcb Assembly Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier