Precision PCBA Fabrication for Aerospace Applications with Buried Vias Technology Video

Name: Precision PCBA Fabrication for Aerospace Applications with Buried Vias Technology
Uploaded: 2024-05-15T10:49:08+08:00
Description: Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.30-2.00 / Piece

Sepcifications

Metal Coating Copper
Mode of Production DIP
Layers Double-Layer
Base Material FR-4
Certification RoHS, ISO
Customized Customized
Condition New
Transport Package Box
Trademark hemeixin
Origin China
Type Rigid Circuit Board
Dielectric Fr-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Insulation Materials Epoxy Resin
Processing Technology Immersion Gold
Copper Thickness 3oz -105oz
Surface Finish Gold Finger
Special Technology Metal Edging
Special 1 Blind Hole
Special 2 Buried Vias
Special 3 Flex-Rigid PCB
Surface Finish 1 Immersion Gold Immersion Tin Hal Lead Free

Product Description

Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

Learn More

Shenzhen Hemeixin Electronic Co., Limited

Diamond Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, Cables, PCBA
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Quick View Precision PCBA Fabrication for Aerospace Applications with Buried Vias Technology Contact Now	New Original UK Raspberry Pi 3 Model B+ Rpi 3 B Plus Contact Now	Original Raspberry Pi 3b+ B Plus Contact Now	Raspberry Pi 3b+ B Plus 1.4GHz Main Board with WiFi Bluetooth Contact Now	Raspberry Pi B Plus 64 Bit Quad Core WiFi Bluetooth E14 Raspberry Pi 3 Model B+ Contact Now

Transaction Info
	Quick View Precision PCBA Fabrication for Aerospace Applications with Buried Vias Technology Contact Now	New Original UK Raspberry Pi 3 Model B+ Rpi 3 B Plus Contact Now	Original Raspberry Pi 3b+ B Plus Contact Now	Raspberry Pi 3b+ B Plus 1.4GHz Main Board with WiFi Bluetooth Contact Now	Raspberry Pi B Plus 64 Bit Quad Core WiFi Bluetooth E14 Raspberry Pi 3 Model B+ Contact Now
Price	US $ 0.30-2.00/ Piece	US $ 180.00-185.00/ Piece	US $ 170.00-185.00/ Piece	US $ 180.00-185.00/ Set	US $ 180.00-186.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Sets	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001	-	-	-	-
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, Europe	North America, Europe	North America, Europe	North America, Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Metal Coating: Copper; Mode of Production: DIP; Layers: Double-Layer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Metal Coating: Copper; Mode of Production: SMT; Layers: Double-Layer; Base Material: FR-4; Customized: Customized; Condition: New; Product Name: Raspberry Pi 3 Model B Pi;	Metal Coating: Copper; Mode of Production: SMT; Layers: Double-Layer; Base Material: FR-4; Customized: Customized; Condition: New; Product Name: Raspberry Pi 3 Model B+;	Metal Coating: Copper; Mode of Production: SMT; Layers: Double-Layer; Base Material: FR-4; Customized: Customized; Condition: New; Product Name: Raspberry Pi 3 Model B Pi;	Metal Coating: Copper; Mode of Production: SMT; Layers: Double-Layer; Base Material: FR-4; Customized: Customized; Condition: New; Product Name: Raspberry Pi 3 Model B Pi;
Supplier Name	Shenzhen Hemeixin Electronic Co., Limited	Sunhokey Electronics Co., Ltd.	Sunhokey Electronics Co., Ltd.	Sunhokey Electronics Co., Ltd.	Sunhokey Electronics Co., Ltd.
Select All

Contact Now

Hot Search