PCB Board
US$0.01-20.00 / Piece
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What is Fr4 Printed Circuit Board Multilayer PCB HDI 1-40 Layers PCB Mother Board China PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-20.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 600*1200 mm
  • Trademark Abis
  • Origin Made in China
  • Layer Counts 1-20 Layers
  • Raw Material Fr-4,Cu Base,High Tg Fr-4,PTFE,Roger
  • Board Thickness 0.20mm-8.00mm
  • Board Outline Tolerance +0.10mm
  • Thickness Tolerance(T≥0.8mm) +/-8%
  • Thickness Tolerance(T<0.8mm) +/-10%
  • Insulation Layer Thickness 0.075mm--5.00mm
  • Minimum Line/Space 0.075mm
  • Drilling Hole(Mechanical) 0.15mm--6.35mm
  • Finish Hole(Mechanical) 0.10mm-6.30mm
  • Surface Finish/Treatment HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

Product Description

FR4 Printed Circuit Board Multilayer PCB HDI 1-40layers PCB Mother Board China PCB Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline ...

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PCB Board Comparison
Transaction Info
Price US $ 0.01-20.00/ Piece US $ 0.30-1.05/ pcs US $ 0.80-2.10/ pcs US $ 0.10-1.20/ pcs US $ 0.80-3.10/ pcs
Min Order 1 Pieces 1 pcs 1 pcs 1 pcs 1 pcs
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer Counts: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Roger;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Thickness Tolerance(T&ge;0.8mm): +/-8%;
Thickness Tolerance(T<0.8mm): +/-10%;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line/Space: 0.075mm;
Drilling Hole(Mechanical): 0.15mm--6.35mm;
Finish Hole(Mechanical): 0.10mm-6.30mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Type: Metal Core PCB;
Dielectric: Aluminium;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Hspcb;
Layers: Single or Two;
Customized: Yes;
Thermal: High Thermal Conductivity;
Type: Rigid-Flex Board;
Dielectric: Fr4+Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier