Printed Circuit Board

US$0.10-100.00 / Piece

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High Frequency PWB Rogers 4003c, 4350b Material Circuit Boards pictures & photos

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What is High Frequency PWB Rogers 4003c, 4350b Material Circuit Boards

Name: High Frequency PWB Rogers 4003c, 4350b Material Circuit Boards
Uploaded: 2022-02-23T14:17:45+08:00
Description: High Frequency PWB Rogers 4003c, 4350b Material Circuit Boards -Definition HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-100.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric Rogers
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material RO
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-6mm
Copper Thickness 0.5-8oz

Product Description

High Frequency PWB Rogers 4003c, 4350b Material Circuit Boards -Definition HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Printed Circuit Board Comparison

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Transaction Info
	Quick View High Frequency PWB Rogers 4003c, 4350b Material Circuit Boards Contact Now	Quick View Advanced Smart TV Logic PCB Technology Contact Now	Quick View OSP Circuit Board with Surface Treatment Contact Now	Quick View Bluetooth Circuit Board Module for Wireless Connectivity Contact Now	Quick View Bluetooth Connectivity Module Circuit Board for Devices Contact Now
Price	US $ 0.10-100.00/ Piece	US $ 0.85-0.90/ Piece	US $ 0.75-0.80/ Piece	US $ 0.18-0.20/ Piece	US $ 0.18-0.20/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T	T/T	T/T	T/T
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS, IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: Rogers; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: RO; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: OSP;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.
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