Mobile Phone Motherboard
US$0.0001-99.00 / Piece
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Polymide Flexible Flex PCB Shenzhen Custom-Made Electronic Pi/Pet 2 Layers FPC PCBA Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.0001-99.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 1 Pieces/Panel
  • Origin Shenzhen, China
  • Layers 1 Layer
  • Solder Mask Green
  • Legend Write
  • Surface Finish OSP

Product Description

Gold Finger Fr4 Tg170 Tg180 CTI600 Printed Circuit Board Embedded Systems PCB 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, ...

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Mobile Phone Motherboard Comparison
Transaction Info
Price US $ 0.0001-99.00/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ PCS US $ 0.1/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 PCS 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal L/C, Paypal L/C, T/T, Paypal L/C, T/T, Western Union L/C, T/T, Western Union, Paypal
Quality Control
Product Certification - - UL(Us&Canada). ISO9001. RoHS, Ts, SGS - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 1 Layer;
Solder Mask: Green;
Legend: Write;
Surface Finish: OSP;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Thickness: 1.6mm;
Surface Treatment: HASL Lead Free/Immersion Gold/Immersion Silver;
Finised Copper Thcikness: 35/35um;
Solder Mask Color: Green/White/Black/Blue/Red;
Ipc Standards: Ipc Class 2;
Lead Time: 7 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Layer: 1-24 Layer;
Base Material Type: Fr4;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Material Finished Thickness: 1.6mm;
Solder Mask Color: Green/White/Black/Blue/Red;
Lead Time: 7 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Layer Count: 4;
Board Thickness: 1.6mm;
Surface Treatment: HASL Lead Free/Immersion Gold/Immersion Silver;
Finised Copper Thcikness: 35/35/35/35um;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: Flying Probe Testing/E-Testing;
Lead Time: 7 Working Days;
Fast Turn: 3 Working Days;
Ipc Standards: Ipc Class 3;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier