Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Computer with LCD Screen, LED;
Structure: Double Sided FPC;
Combination Mode: Adhesive Flexible Plate;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Quality Assurance: UL, ISO9001, Aoi Inspection, RoHS, 100% E-Test,Fqc;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: 94V-0;
Application: Communication;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green Blue Black;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Quality Assurance: UL, ISO9001, Aoi Inspection, RoHS, 100% E-Test,Fqc;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Quality Assurance: UL, ISO9001, Aoi Inspection, RoHS, 100% E-Test,Fqc;
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