Customized Fr-4 Blue Solder Mask OEM Custom-Made Electronic SMT DIP Assembly Prototype Manufacturer Multilayer PCB & PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-20.00 / Piece

Sepcifications

  • Structure Flush Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper ,PP
  • Insulation Materials Epoxy Resin
  • Brand Kb,Shenyi,Rogers,Iteq
  • Transport Package Vacuum Packing
  • Specification 220*260
  • Trademark Abis
  • Origin China

Product Description

ABIS CIRCUITS CO., LTD Briefly introduce our strengths: 1. A professional PCB manufacturer which was established on Oct, 2006 2. Focusing on double side, Multilayer and HDI pcb mass production 3. Two factories, one for small and middle volume orders, another for big volume and HDI ...

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Printed Circuit Board Comparison
Transaction Info
Price US $ 0.10-20.00/ Piece US $ 2.25-8.80/ Piece US $ 2.87-9.30/ Piece US $ 0.1/ Piece US $ 0.1/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, 30 days net T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 10L up to 60L;
Board Thickness: 1.2mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 51um;
Min. Trace/Space: 5.5/4mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 12L up to 60L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 45um;
Min. Trace/Space: 0.154/0.088mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6L up to 60L;
Board Thickness: 1.0mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 35um;
Min. Trace/Space: 0.233/0.173mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6L up to 60L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 35um;
Min. Trace/Space: 0.23/0.13mm;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier