Abis Circuits

US$0.10-0.12 / Piece

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2layer 4layer TDS Meter Moisture Energy PCB Printed Circuit Board PCBA Assembly pictures & photos

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What is 2layer 4layer TDS Meter Moisture Energy PCB Printed Circuit Board PCBA Assembly

Name: 2layer 4layer TDS Meter Moisture Energy PCB Printed Circuit Board PCBA Assembly
Uploaded: 2023-08-11T14:45:17+08:00
Description: PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min B

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.12 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Em825
Application Automotive Electronics, Security, Digital Products
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Abis Circuits
Transport Package Vacuum Packaging
Specification FR4
Trademark Abis circuits
Origin Shenzhen, China
Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949
Copper Thickness 4oz
Min Line Width/Space 0.45mm
Surface Finish Enig
Solder Mask Color Green
Layer 2
Board Thickness 1.6mm

Product Description

PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min BGA size: 0.1-0.63mm 7 Min QFP space: 0.35mm 8 Min assembly size: (X*Y): 50*30mm 9 ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Abis Circuits Comparison

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Transaction Info
	Quick View 2layer 4layer TDS Meter Moisture Energy PCB Printed Circuit Board PCBA Assembly Contact Now	Quick View Ceramic Substrate Printed Board Sequentially-Laminated Mulitlaye Double-Sided Printed Board (DSB) Contact Now	Quick View Single Sided Double Layer PCB Board PCBA Manufacturing with Components Electronic Printed Circuit Board Assembly Process Contact Now	Quick View LED Printed Circuit Board PCB Assembly Components 1 Layer Single Multiple Layer One Layer PCB Design Contact Now	Quick View Rapid PCB Prototyping PCB Printing Cost SMT Full Turnkey Industrial PCB Fabrication and Assembly Contact Now
Price	US $ 0.10-0.12/ Piece	US $ 0.2/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS, IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM, Own Brand	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Em825; Application: Automotive Electronics, Security, Digital Products; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis Circuits; Copper Thickness: 4oz; Min Line Width/Space: 0.45mm; Surface Finish: Enig; Solder Mask Color: Green; Layer: 2; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Voltage Plane: Voltage; Jointed Board: Single Panel Dual Panel; Wave Soldering: Waviness; Thin Film: Thin Film Hybrid Circuit; Conductor Trace Line: Flush Conductor; Thick Film: Thick Film Circuit;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;
Supplier Name	Abis Circuits Co., Ltd.	Jian Unice Pcb Technique Co., Ltd	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited
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