Abis Circuits

US$0.10-0.20 / Piece

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Rogers High-Frequency PCB Board 4-Layer Mixed-Press High-Frequency PCB pictures & photos

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What is Rogers High-Frequency PCB Board 4-Layer Mixed-Press High-Frequency PCB

Name: Rogers High-Frequency PCB Board 4-Layer Mixed-Press High-Frequency PCB
Uploaded: 2023-08-08T14:49:28+08:00
Description: PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min B

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.20 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Em825
Application Automotive Electronics, Security, Digital Products
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Abis Circuits
Transport Package Vacuum Packaging
Specification FR4
Trademark Abis circuits
Origin Shenzhen, China
Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949
Copper Thickness 4oz
Min Line Width/Space 0.45mm
Surface Finish Enig
Solder Mask Color Green
Layer 4
Board Thickness 1.6mm

Product Description

PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min BGA size: 0.1-0.63mm 7 Min QFP space: 0.35mm 8 Min assembly size: (X*Y): 50*30mm 9 ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Abis Circuits Comparison

	Quick View Rogers High-Frequency PCB Board 4-Layer Mixed-Press High-Frequency PCB Contact Now	Quick View Turnkey Electronics Prototype PCB Manufacturing Component Sourcing BGA Assembly SMT Assembly Contact Now	Quick View 3D Printing PCB Prototyping Ai-Powered PCB Design Thermal Management in Power Supply Pcbs Contact Now	Quick View China Professional Custom Boards Manufacturer Multilayer PCB Contact Now	Quick View Shenzhen Custom Electronic OEM Multilayer PCB Supplier Electronics Board Contact Now

Transaction Info
	Quick View Rogers High-Frequency PCB Board 4-Layer Mixed-Press High-Frequency PCB Contact Now	Quick View Turnkey Electronics Prototype PCB Manufacturing Component Sourcing BGA Assembly SMT Assembly Contact Now	Quick View 3D Printing PCB Prototyping Ai-Powered PCB Design Thermal Management in Power Supply Pcbs Contact Now	Quick View China Professional Custom Boards Manufacturer Multilayer PCB Contact Now	Quick View Shenzhen Custom Electronic OEM Multilayer PCB Supplier Electronics Board Contact Now
Price	US $ 0.10-0.20/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece	US $ 1.00-100.00/ Square Meter	US $ 1.00-100.00/ Square Meter
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Square Meters	1 Square Meters
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	Online transactions	Online transactions
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS, IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Em825; Application: Automotive Electronics, Security, Digital Products; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis Circuits; Copper Thickness: 4oz; Min Line Width/Space: 0.45mm; Surface Finish: Enig; Solder Mask Color: Green; Layer: 4; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fiberglass; Insulation Materials: Organic Resin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fiberglass; Insulation Materials: Organic Resin;
Supplier Name	Abis Circuits Co., Ltd.	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited	Shenzhen Shitu Electronics Co., Ltd.	Shenzhen Shitu Electronics Co., Ltd.
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