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US$0.10-100.00 / piece

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2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board pictures & photos

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What is 2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board

Name: 2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board
Uploaded: 2022-12-13T17:08:38+08:00
Description: 2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board Abis Circuits Co., Ltd is a professional PCB manufacturer which was established on Oct, 2006 and foc

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About this Item

Price

Min. Order Reference FOB Price

1 piece US$0.10-100.00 / piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 240*200
Trademark ABIS CIRCUITS CO., LTD
Origin Shenzhen, China
Board Thickness 1.6mm
Copper Thickness 35um
Surface Finish Immersion Gold
Solder Mask Blue
Legend White
Mini Hole Size 0.15mm
Mini Space Trace 0.15mm

Product Description

2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board Abis Circuits Co., Ltd is a professional PCB manufacturer which was established on Oct, 2006 and focus on double side, Multilayer and HDI pcb mass production. We have two factories together , ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Board Comparison

	Quick View 2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board Contact Now	Quick View Cem3 PCB with 1W/M. K Thermal Conductivity Contact Now	Quick View Multi-Layer PCB, From 4-16 Layer Immersion Gold PCB Contact Now	Quick View Esp32 Programming Circuit Rapid PCB Prototyping Panel Design Small Metal Clad HDI PCB Manufacturer Contact Now	Quick View Shenzhen Customized LED Aluminum PCB Dielectric Thickness 100um-150um Contact Now

Transaction Info
	Quick View 2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board Contact Now	Quick View Cem3 PCB with 1W/M. K Thermal Conductivity Contact Now	Quick View Multi-Layer PCB, From 4-16 Layer Immersion Gold PCB Contact Now	Quick View Esp32 Programming Circuit Rapid PCB Prototyping Panel Design Small Metal Clad HDI PCB Manufacturer Contact Now	Quick View Shenzhen Customized LED Aluminum PCB Dielectric Thickness 100um-150um Contact Now
Price	US $ 0.10-100.00/ piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece
Min Order	1 piece	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Immersion Gold; Solder Mask: Blue; Legend: White; Mini Hole Size: 0.15mm; Mini Space Trace: 0.15mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.2mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.2mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.2mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;
Supplier Name	Abis Circuits Co., Ltd.	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited
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