Immersion Gold PCB
US$0.01-100.00 / Piece
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What is Hard Gold PCB Multilayer Printed Circuit Board with Blind and Buried Vias

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Kingboard
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
  • Enig Thickness 1-3u′′
  • Board Thickness 0.2-6mm
  • Hard Gold Thickness 1-50u′′
  • Layers 1-20layers
  • Copper Thickness 0.5-8oz
  • Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949

Product Description

Hard Gold PCB Multilayer Printed Circuit Board with Blind and Buried Vias 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, gold plating/finger, ...

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Immersion Gold PCB Comparison
Transaction Info
Price US $ 0.01-100.00/ Piece US $ 0.15-9.98/ Piece US $ 1.50-3.50/ PCS US $ 0.10-0.50/ Piece US $ 0.15-9.98/ Piece
Min Order 1 Pieces 1 Pieces 1 PCS 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union L/C, T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949 - ISO, UL, RoHS,CE,IATF - -
Management System Certification ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe -
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM OEM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
-
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kingboard;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Enig Thickness: 1-3u'';
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 1-50u'';
Layers: 1-20layers;
Copper Thickness: 0.5-8oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
Type: PCBA;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
Condition: Original Made;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 12;
Thickness: 0.96mm;
Soldmask: Green;
Surface: Plated Gold;
Silkscreen: White;
Certificates: UL, ISO, Ts16949;
Hole Quantity Per PCS: 1200;
Min Line Width/ Space: 0.1/0.1mm;
Use: Electronic Production;
Panel: 6PCS/Set;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Dongguan Chenlu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Dongguan Chenlu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier