Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
|
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
|
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
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