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US$0.0001-29.90 / Piece

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What is Thermoelectric Separation Copper Substrate Heat Dissipation

Name: Thermoelectric Separation Copper Substrate Heat Dissipation
Uploaded: 2023-10-23T16:06:34+08:00
Description: Thermoelectric separation copper substrate heat dissipation 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Ho

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Price

Min. Order Reference FOB Price

1 Piece US$0.0001-29.90 / Piece

Sepcifications

Insulation Materials Metal Composite Materials
Flame Retardant Properties V0
Application LED Lighting
Transport Package Vacuum Packing
Specification 52mm*52mm
Trademark Abis
Origin Shenzhen, China
Solder Mask Black
Surface Finish HASL Lf
Base Material Alu
Character for Lighting
Copper Thickness 35um

Product Description

Thermoelectric separation copper substrate heat dissipation 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

SMD Comparison

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Transaction Info
	Quick View Thermoelectric Separation Copper Substrate Heat Dissipation Contact Now	Quick View PCB Motherboard Supplier Flex Circuit Board for FPC Rigid-Flex PCB Contact Now	Quick View Custom Electronic Circuit Board Turnkey Service Flexible Rigid-Flex PCB Contact Now	Quick View FPC Board OEM Prototype Customized Rigid-Flex PCB Contact Now	Quick View Main Board Gold PCB Rigid Circuit Boards FPC Board Rigid-Flex PCB Contact Now
Price	US $ 0.0001-29.90/ Piece	US $ 1.00-20.00/ Piece	US $ 1.00-20.00/ Piece	US $ 1.00-20.00/ Piece	US $ 1.00-20.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	-	RoHS, UL CE, GS, ISO	RoHS, UL CE, GS, ISO	RoHS, UL CE, GS, ISO	RoHS, UL CE, GS, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Insulation Materials: Metal Composite Materials; Flame Retardant Properties: V0; Application: LED Lighting; Solder Mask: Black; Surface Finish: HASL Lf; Base Material: Alu; Character: for Lighting; Copper Thickness: 35um;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Aerospace; Base Material: Pi+Fr4; Service: 724 Hours Online;* Technology: Lead The Industry; Processing Technology: Electrolytic Foil; Delivery: 5days; Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Aerospace; Base Material: Pi+Fr4; Service: 724 Hours Online;* Technology: Lead The Industry; Processing Technology: Electrolytic Foil; Delivery: 5days; Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Aerospace; Base Material: Pi+Fr4; Service: 724 Hours Online;* Technology: Lead The Industry; Processing Technology: Electrolytic Foil; Delivery: 5days; Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;	Insulation Materials: Organic Resin; Flame Retardant Properties: V0; Application: Aerospace; Base Material: Pi+Fr4; Service: 724 Hours Online;* Technology: Lead The Industry; Processing Technology: Electrolytic Foil; Delivery: 5days; Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
Supplier Name	Abis Circuits Co., Ltd.	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED
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