Specification |
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Abis;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Membrane;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Product Certificate: ASTM F963-16, CCC, FCC, Ce, RoHS, SGS, Ect;
Company Certification: Universal Studios, Bandai, BV, Ohsas1;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Rear Adhesive: 3m 467MP,3m 468MP,3m 9448A,3m 9080, 3m 200, 3m 300;
Materials: PC/PVC/Pet/PCB/FPC/PMMA/Silicon;
Life Expectancy: 1, 000, 000 Actuations Per Switch Position;
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Structure: Double-Sided FPC;
Material: Polyimide, Pi;
Flame Retardant Properties: V0;
Base Material: Copper;
Type: Flexible Printed Circuit Board;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
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