Multilayer PCB
US$0.10-1.21 / Piece
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What is 1layer to 20layers Controller Circuit PCB Board for WiFi

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-1.21 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 130mm*100mm
  • Origin China
  • Test Flying Probe and Fixture
  • Solder Mask Green/ Custom
  • Certificates UL, RoHS, SGS, ISO9001
  • Board Thickness 1.8mm / 1.6mm / 2.0mm Custom
  • Custom OEM / ODM
  • Copper 0.5oz / 18um, 2oz / 70um Custom
  • Layers 1-20 Layers, Custom
  • Legend White

Product Description

1Layer To 20Layers Controller Circuit PCB Board For WiFi Technical &Capability Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.10-1.21/ Piece US $ 0.86-3.50/ pcs US $ 1.00-3.50/ pcs US $ 0.30-1.05/ pcs US $ 0.30-1.20/ pcs
Min Order 1 Pieces 1 pcs 1 pcs 1 pcs 1 pcs
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green/ Custom;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.8mm / 1.6mm / 2.0mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um Custom;
Layers: 1-20 Layers, Custom;
Legend: White;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Metal Core PCB;
Dielectric: Aluminium;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Hspcb;
Layers: Single or Two;
Customized: Yes;
Thermal: High Thermal Conductivity;
Type: Flexible Circuit Board;
Dielectric: Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: Hspcb;
Customized: Yes;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier