Sic Wafer
US$185.00-205.00 / Piece
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What is Conductive 2/4/6 Inches 4h-N P Grade Silicon Carbide Substrate Sic Wafer

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

20-99 Pieces US$205.00

100-499 Pieces US$198.00

500-999 Pieces US$192.00

1,000+ Pieces US$185.00

Sepcifications

  • Manufacturing Technology Chemical Vapor Deposition
  • Material Sic
  • Type N-type Semiconductor
  • Package Custom
  • Signal Processing No
  • Application Semiconductor
  • Model 4h-N
  • Batch Number No
  • Brand No
  • Transport Package Foam Bag
  • Specification 4 6 inches
  • Trademark No
  • Origin China
  • Grade P & D Grade
  • Spec 4 Inches 6 Inches etc
  • Raw Material 6n Sic
  • Types N or Si

Product Description

Product Details Silicon carbide (SiC), is known as the core material of the third generation semiconductor. It has many outstanding characteristics, such ashigh voltage, high frequency, high bandwidth,high thermal conductivity, high breakdown electric field and electron saturation rate. ...

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Sic Wafer Comparison
Transaction Info
Price US $ 185.00-205.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece
Min Order 20 Pieces 25 Pieces 25 Pieces 25 Pieces 25 Pieces
Trade Terms - - - - -
Payment Terms T/T, CNY Account T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM Own Brand Own Brand Own Brand Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Manufacturing Technology: Chemical Vapor Deposition;
Material: Sic;
Type: N-type Semiconductor;
Package: Custom;
Signal Processing: No;
Application: Semiconductor;
Model: 4h-N;
Batch Number: No;
Brand: No;
Grade: P & D Grade;
Spec: 4 Inches 6 Inches etc;
Raw Material: 6n Sic;
Types: N or Si;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Supplier Name

Hebei Baotong New Material Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier