Specification |
Application: Food, Promotion, Household, Chemical, Apparel;
Feature: Moisture Proof, Recyclable, Bio-Degradable, Disposable, Shock Resistance, Antistatic;
Material: PP;
Shape: Plastic Bags;
Making Process: Plastic Packaging Bags;
Raw Materials: Polypropylene Plastic Bag;
Bag Variety: Upright Bag;
Mesh: 7*7-14*14;
Width: 28-400cm;
Surface Dealing: Coating or Plain ;Printing or No Printing;
Top: Heat Cut, Cold Cut, Zig-Zag Cut or Hemmed;
Color: White Red Yellow or as Customer Requirement;
Treatment: UV Treated or as Per Your Requirements;
GSM: 40GSM- 250GSM;
Denier: 650d to 2000d;
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Application: Food, Promotion, Household;
Feature: Moisture Proof, Bio-Degradable, Disposable, Shock Resistance, Antistatic;
Material: Laminated Material;
Shape: Square Bottom Bag;
Making Process: Plastic Packaging Bags;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Flat Bottom Pouch, Box Pouch;
Product Name: Food Ziplock Biodegradable Eco Bag Polyester Manuf;
OEM: Avaiable;
Logo: Accept Customized Logo Printing;
Colors: up to 10 Colors;
Size: Customized Size;
Samples: Avaiable;
Price Term: CIF or Fob Jiangmen;
Usage: Packaging;
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Application: Food, Promotion, Household;
Feature: Moisture Proof, Bio-Degradable, Disposable, Shock Resistance, Antistatic;
Material: Laminated Material;
Shape: Square Bottom Bag;
Making Process: Plastic Packaging Bags;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Flat Bottom Pouch, Box Pouch;
Product Name: Recycle Doypack PLA Biodegradable Polybag Wholesal;
OEM: Avaiable;
Logo: Accept Customized Logo Printing;
Colors: up to 10 Colors;
Size: Customized Size;
Samples: Avaiable;
Price Term: CIF or Fob Jiangmen;
Usage: Packaging;
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Application: Electronics;
Feature: Moisture Proof, Recyclable, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
OEM: Available;
Purpose: Electronics, Conductor, PCB, Chip, etc;
Thickness: 0.08-0.16mm;
Performance: Anti-Static, Moisture Barrier;
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Application: Electronics;
Feature: Moisture Proof, Recyclable, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
OEM: Available;
Purpose: Electronics, Conductor, PCB, Chip, etc;
Thickness: 0.08-0.16mm;
Performance: Anti-Static, Moisture Barrier;
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