High Precision

US$30,000.00-50,000.00 / Piece

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What is Bozhon High-Quality Production Die Bonder Machine

Name: Bozhon High-Quality Production Die Bonder Machine
Uploaded: 2023-09-19T14:30:37+08:00
Description: Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding

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Price

Min. Order Reference FOB Price

1 Piece US$30,000.00-50,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed High Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1160mm*1225mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Binding Force 10~7,500 G (Programmable)
Uph 7000(Max)
X/Y Placement Accuracy ± 7µm @ 3σ
Theta Placement Accuracy ±0.15°@ 3σ
Bonding Head Heatingtemperatur up to 350 °c (Optional)

Product Description

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy of ±7@3σ microns and can achieve an ultimate bonding efficiency of up ...

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Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

High Precision Comparison

	Quick View Bozhon High-Quality Production Die Bonder Machine Contact Now	SMT FUJI Nxt H04s 1.8 Nozzle AA8ww08 for FUJI Machine Contact Now	Quick View AA8xa07 FUJI Nxt H04s 2.5g Nozzle for SMT Machine Contact Now	Quick View SMT AA8wx08 FUJI Nxt H04s 2.5 Nozzle From China Supplier Contact Now	Quick View SMT AA8xc07 FUJI Nxt H04s 5.0g Nozzle in High Rank Contact Now

Transaction Info
	Quick View Bozhon High-Quality Production Die Bonder Machine Contact Now	SMT FUJI Nxt H04s 1.8 Nozzle AA8ww08 for FUJI Machine Contact Now	Quick View AA8xa07 FUJI Nxt H04s 2.5g Nozzle for SMT Machine Contact Now	Quick View SMT AA8wx08 FUJI Nxt H04s 2.5 Nozzle From China Supplier Contact Now	Quick View SMT AA8xc07 FUJI Nxt H04s 5.0g Nozzle in High Rank Contact Now
Price	US $ 30,000.00-50,000.00/ Piece	US $ 33.00-35.00/ Piece	US $ 26.00-30.00/ Piece	US $ 25.00-30.00/ Piece	US $ 25.00-35.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Product Certification	ISO, CE	ISO, CE	ISO, CE	ISO, CE	ISO, CE
Management System Certification	ISO 9001	ISO 9001, ISO 9000	ISO 9001, ISO 9000	ISO 9001, ISO 9000	ISO 9001, ISO 9000
Trade Capacity
Export Markets	Domestic	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM, Own Brand, Others	OEM, ODM, Own Brand, Others	OEM, ODM, Own Brand, Others	OEM, ODM, Own Brand, Others
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 10~7,500 G (Programmable); Uph: 7000(Max); X/Y Placement Accuracy: ± 7µm @ 3σ; Theta Placement Accuracy: ±0.15°@ 3σ; Bonding Head Heatingtemperatur: up to 350 °c (Optional);	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; MOQ: 1PC; Weight: 0.01; Packaging: FUJI Nozzle Box; Payment: 100% T/T Advance; Color: Black;	Condition: New; Speed: High Speed; Precision: Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; MOQ: 1PC; Weight: 0.01; Packaging: 20PCS/Box;	Condition: New; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; MOQ: 1PC; Weight: 0.01; Packaging: FUJI Nozzle Box; Package: Standard Package; Delivery: 10-15 Working Days; Payment: 100% T/T Advance;	Condition: New; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; MOQ: 1PC; Weight: 0.01; Packaging: 20PCS/Box;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Guangdong Juguangheng Automation Equipment Co., Ltd.	Guangdong Juguangheng Automation Equipment Co., Ltd.	Guangdong Juguangheng Automation Equipment Co., Ltd.	Guangdong Juguangheng Automation Equipment Co., Ltd.
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