High Precision

US$100,000.00-300,000.00 / Piece

View

Multi Strip Advanced Die Bonding Machine pictures & photos

Recommend for you
What is High Speed Die Bonding Machine- Process for Molding a Chip on a Package Substrate
What is High Precision Eutectic Machine with Multiple Wafer Feeding for Mass Production
What is Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines

What is Multi Strip Advanced Die Bonding Machine

Name: Multi Strip Advanced Die Bonding Machine
Uploaded: 2023-09-19T16:09:31+08:00
Description: Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-300,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed High Speed
Precision High Precision
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1160mm*1225mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Binding Force 500 N (Max)
Wafer Size Wafer Size: 8" - 12" (4", 6" Customizable)
Substrate Type Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe
Uph up to 10,000 Pieces Per Hour (Max)

Product Description

Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an accuracy of ±10 microns and an ultimate bonding force of up to 500N and an ...

Learn More

Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

High Precision Comparison

	Quick View Multi Strip Advanced Die Bonding Machine Contact Now	Quick View Moje Patching Manufacturing M612 Chip SMT Machine Contact Now	Quick View Moje Patching Robotics M612 PCBA Mob Chip Mounter Contact Now	Moje Chip Mounter M512t for LED Lens Lighting Industry SMT Machine Contact Now	Moje SMT Equipment M512t Pick and Place Machine Contact Now

Transaction Info
	Quick View Multi Strip Advanced Die Bonding Machine Contact Now	Quick View Moje Patching Manufacturing M612 Chip SMT Machine Contact Now	Quick View Moje Patching Robotics M612 PCBA Mob Chip Mounter Contact Now	Moje Chip Mounter M512t for LED Lens Lighting Industry SMT Machine Contact Now	Moje SMT Equipment M512t Pick and Place Machine Contact Now
Price	US $ 100,000.00-300,000.00/ Piece	US $ 34300/ Piece	US $ 34300/ Piece	US $ 25700/ Piece	US $ 25700/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal
Quality Control
Product Certification	-	CCC, RoHS, ISO, CE	CCC, RoHS, ISO, CE	CCC, RoHS, ISO, CE	CCC, RoHS, ISO, CE
Management System Certification	ISO 9001	ISO 14001	ISO 14001	ISO 14001	ISO 14001
Trade Capacity
Export Markets	Domestic	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	-	-	-
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 500 N (Max); Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable); Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe; Uph: up to 10,000 Pieces Per Hour (Max);	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Guangdong Moje Intelligent Equipment Co., Ltd.	Guangdong Moje Intelligent Equipment Co., Ltd.	Guangdong Moje Intelligent Equipment Co., Ltd.	Guangdong Moje Intelligent Equipment Co., Ltd.
Select All

Contact Now

Hot Search