Die Bonding
US$250,000.00-450,000.00 / Piece
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What is Chip Bonding Machine Die Bonder PCB Assembly Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$250,000.00-450,000.00 / Piece

Sepcifications

  • After-sales Service 7*24 Hour After-Sales Service
  • Condition New
  • Speed Medium Speed
  • Precision High Precision
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Crates and Vacuum Wooden Crates
  • Specification 1900mm*1100mm*1800mm
  • Trademark Suzhou Bozhon Semiconductor Co
  • Origin China
  • Placement Process Eutectic, Underfill
  • Equipment Application Coc,COB,Gold Box,Cow,Cos
  • Nozzle 12 Nozzles Per Single Head, Dynamictool Chan
  • Workbench 2
  • Wafer 6 Inch, Supports up to 4 Piece
  • Waffle Pack Gel-Pak 2 Inch, Supports up to 2 Pieces

Product Description

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields ...

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Die Bonding Comparison
Transaction Info
Price US $ 250,000.00-450,000.00/ Piece US $ 13999/ Piece US $ 13999/ Piece US $ 104,500.00-105,000.00/ Piece US $ 13999/ Set
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Sets
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T T/T, Western Union, Paypal
Quality Control
Product Certification - ISO ISO ISO, CE CE
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand ODM, Own Brand ODM, Own Brand Own Brand ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Placement Process: Eutectic, Underfill;
Equipment Application: Coc,COB,Gold Box,Cow,Cos;
Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan;
Workbench: 2;
Wafer: 6 Inch, Supports up to 4 Piece;
Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Model: Neoden9;
Max Speed: 1,4000cph;
Average Speed: 9000cph for Drive Board;
Nozzle Head: 6;
Vision: Flying Vision System;
Feeder Qty: 53PCS (If 8mm/ 12mm);
Packing Size: 1241*903*1562mm;
Smallest Component: Imperial 0201;
Max PCB Width: 300mm;
Max PCB Length: 800mm;
After-sales Service: SMD Pick and Place Machine/ Chip Mounter;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
SMT Machine Model: Neoden9 SMD Placement Machine;
Max Speed: 1,4000cph;
Average Speed: 9000cph for Drive Board;
Nozzle Head: 6;
Vision: Flying Vision System;
Feeder Qty: 53PCS (If 8mm/ 12mm);
Packing Size: 1241*903*1562mm;
Smallest Component: Imperial 0201;
Max PCB Width: 300mm;
Max PCB Length: 800mm;
After-sales Service: All Life;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Mount Head: 6 PCS;
Max Circuit Board Size: 1200*350mm;
Max Moving Range: X Axis 1500mm, Y Axis410mm;
Max Moving Range of Z Axis: 15mm;
Typical Mounting Speed: 93000-140000cph;
Max Mount Speed: 180000cph;
Mount Accuracy: +/-0.1mm;
Position Method: Machinery Position;
Component Available: 0603 and Above SMD Component and LED, Sot, Sop;
Dimension: 2600×680×1500mm;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 6;
Feeder Qty: 53;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max PCB Size: 300mm*800mm;
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
Supplier Name

Suzhou Bozhon Semiconductor Co., Ltd

China Supplier - Gold Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Termway (Beijing) Precision Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier