High Precision
US$100,000.00-200,000.00 / Piece
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What is China Semi-Automatically Die Bonding Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-200,000.00 / Piece

Sepcifications

  • After-sales Service 7*24 Hour After-Sales Service
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Crates and Vacuum Wooden Crates
  • Specification 1160mm*1225mm*1800mm
  • Trademark Suzhou Bozhon Semiconductor Co
  • Origin China
  • Binding Force 500 N (Max)
  • Wafer Size Wafer Size: 8" - 12" (4", 6" Customizable)
  • Substrate Type Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe
  • Uph up to 10,000 Pieces Per Hour (Max)

Product Description

Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an accuracy of ±10 microns and an ultimate bonding force of up to 500N and an ...

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High Precision Comparison
Transaction Info
Price US $ 100,000.00-200,000.00/ Piece US $ 14,972.00-14,999.00/ Piece US $ 2,872.00-2,899.00/ Set US $ 2899/ Set US $ 13999/ Piece
Min Order 1 Pieces 1 Pieces 1 Sets 1 Sets 1 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, Paypal
Quality Control
Product Certification - ISO, CE CE CE ISO, CE
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand ODM, Own Brand ODM, Own Brand ODM, Own Brand ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 500 N (Max);
Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable);
Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe;
Uph: up to 10,000 Pieces Per Hour (Max);
After-sales Service: Two Years of Online After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Model: Neoden K1830;
Max Speed: 16,000cph for LED Assembly;
Average Speed: 8500cph for Drive Board;
Nozzle Head: 8;
Vision: Flying Vision System;
Feeder Qty: 66PCS (If 8mm/ 12mm);
Packing Size: 142*122*166.5cm;
Smallest Component: Imperial 0201;
Max IC: 40*40mm;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: Medium-speed Chip Mounter;
Head Qty: 2;
Feeder Qty: 52 (All 8mm);
Nozzle Change Capacity: 3 Nozzle Slots;
Placement Rate: 3,000cph (Vision on)-4,000cph (Vision off);
Component Range: 0201, 0402, BGA, Qfn, Tqfp, Fpga;
Max. PCB Size: 249 X 350mm(with 2 Sides Tape Feeders));
Alignment: Vision & Vacuum;
Accuracy: +-0.02mm;
Power: 50W;
Air Supply: >0.6MPa;
Max Component Height: 12mm;
Z-Axis Max Movement Range: 28mm;
Control System: One-Board Integration;
Weight: 47kgs(Plywood Case);
Packing Size: 700(L)X610(W)X620(H)mm;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: Medium-speed Chip Mounter;
Application: SMD Assembly;
Feeder Qty: 52 (All 8mm);
Nozzle Change Capacity: 3 Nozzle Slots;
Placement Rate: 3,000cph (Vision on)-4,000cph (Vision off);
Component Range: 0201, 0402, BGA, Qfn, Tqfp, Fpga;
Max. PCB Size: 249 X 350mm(with 2 Sides Tape Feeders));
Alignment: Vision & Vacuum;
Accuracy: +-0.02mm;
Power: 50W;
Air Supply: >0.6MPa;
Max Component Height: 12mm;
Z-Axis Max Movement Range: 28mm;
Control System: One-Board Integration;
Weight: 47kgs(Plywood Case);
Packing Size: 700(L)X610(W)X620(H)mm;
After-sales Service: Two Years of Online After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Model: Neoden9;
Max Speed: 1,4000cph;
Average Speed: 9000cph for Drive Board;
Nozzle Head: 6;
Vision: Flying Vision System;
Feeder Qty: 53PCS (If 8mm);
Packing Size: 1241*903*1562mm;
Smallest Component: Imperial 0201;
Max PCB Width: 300mm;
Max PCB Length: 800mm;
Supplier Name

Suzhou Bozhon Semiconductor Co., Ltd

China Supplier - Gold Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier