High Precision

US$100,000.00-300,000.00 / Piece

View

Automatic Multi Die Chip Epoxy Bonding Machine pictures & photos

Recommend for you
What is Domestic Bozhong Semiconductor Fully Automatic, High-Precision, and Multifunctional Eutectic Machine Equipment
What is High Speed Die Bonding Machine- Process for Molding a Chip on a Package Substrate
What is High Precision R&D Using Small Die Bonder Can Reach Die Bonder

What is Automatic Multi Die Chip Epoxy Bonding Machine

Name: Automatic Multi Die Chip Epoxy Bonding Machine
Uploaded: 2023-10-09T16:12:01+08:00
Description: Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-300,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed High Speed
Precision High Precision
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1160mm*1225mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Binding Force 500 N (Max)
Wafer Size Wafer Size: 8" - 12" (4", 6" Customizable)
Substrate Type Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe
Uph up to 10,000 Pieces Per Hour (Max)

Product Description

Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an accuracy of ±10 microns and an ultimate bonding force of up to 500N and an ...

Learn More

Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

High Precision Comparison

	Quick View Automatic Multi Die Chip Epoxy Bonding Machine Contact Now	Quick View Pick and Place Machine Samsung High Speed Mounter Contact Now	Quick View Sm482plus Chip Mounter LED Placement Equipment Pick and Place Machine Contact Now	Quick View Hanwha SMT Chip Shooter LED Pick and Place Machine Contact Now	Quick View YAMAHA SMT Pick and Place Machine Europlacer Electronic Product Placement Machine Contact Now

Transaction Info
	Quick View Automatic Multi Die Chip Epoxy Bonding Machine Contact Now	Quick View Pick and Place Machine Samsung High Speed Mounter Contact Now	Quick View Sm482plus Chip Mounter LED Placement Equipment Pick and Place Machine Contact Now	Quick View Hanwha SMT Chip Shooter LED Pick and Place Machine Contact Now	Quick View YAMAHA SMT Pick and Place Machine Europlacer Electronic Product Placement Machine Contact Now
Price	US $ 100,000.00-300,000.00/ Piece	US $ 26000/ Piece	US $ 74000/ Set	US $ 74000/ Set	US $ 74,000.00-100,000.00/ Set
Min Order	1 Pieces	1 Pieces	1 Set	1 Set	1 Set
Trade Terms	-	FOB	FOB, CIF, EXW	FOB	FOB
Payment Terms	T/T	L/C, T/T, Western Union, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	CE	CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr	CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr	CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr
Management System Certification	ISO 9001	ISO 9001, ISO 14000, LEED, ISO 17025	ISO 9001, ISO 14000, LEED, ISO 17025	ISO 9001, ISO 14000, LEED, ISO 17025	ISO 9001, ISO 14000, LEED, ISO 17025
Trade Capacity
Export Markets	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 500 N (Max); Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable); Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe; Uph: up to 10,000 Pieces Per Hour (Max);	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: LED Pick and Place Machine; Placement Speed: 46000cph; Usage: SMT, SMD, LED, PCB, PCBA; Head Number: 1; Nozzle Number: 8; Placement Accuracy: +/-50 μm; Component Range: 0603~8520 Chip, LED Chip; Feeder Inputs: 20PCS; Dimension (LWH: 205012001400; Weight: Approx.950kg;	Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 18 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: Samsung Pick and Place Machine 482 Plus; Placement Speed: 30000cph; Usage: SMT, SMD, LED, PCB, PCBA; Power Supply: AC220V 50Hz / AC110V 60Hz; Air Consumption: 0.5 ~ 0.7MPa(5 ~ 7kgf/Cm2); Dimension: 1650(L)1680(D)1530(H); Weight: 1600kg; Feeder: 120 Pieces; PCB Thickness: 0.38-4.2mm; Max. Component Height: 15mm;	Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 18 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: Samsung Pick and Place Machine 482 Plus; Placement Speed: 30000cph; Usage: SMT, SMD, LED, PCB, PCBA; Power Supply: AC220V 50Hz / AC110V 60Hz; Air Consumption: 0.5 ~ 0.7MPa(5 ~ 7kgf/Cm2); Dimension: 1650(L)1680(D)1530(H); Weight: 1600kg; Feeder: 120 Pieces; PCB Thickness: 0.38-4.2mm; Max. Component Height: 15mm;	Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 18 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: YAMAHA Pick and Place Machine; Placement Speed: 46000 Cph; Usage: SMT, SMD, LED, PCB, PCBA; Applicable Components: 03015-W 55 X L 100mm (Divided Recognition for Over; Mounting Accuracy: +-0.035 mm; Number of Component Types: Setting Plate : Max 96 Types (8mm Width Tape Feede; Power Supply: 3-Phase AC 200/208/220/240/380/400/416 V+-10%; Air Supply Source: 0.45MPa or More, Clean and Dry State; External Dimension: L 1,254 X W 1,440 X H 1,445mm (Excluding Protrusio; Weight: 1,270kg;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Dongguan ICT Technology Co.,Ltd.	Dongguan ICT Technology Co.,Ltd.	Dongguan ICT Technology Co.,Ltd.	Dongguan ICT Technology Co.,Ltd.
Select All

Contact Now

Hot Search