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US$5,000.00-250,000.00 / Piece

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Pau1115-153 OEM High Efficiency ISO Approved Precision Chip Sorting Equipment Semiconductor Industry Machine Chip-BGA/Qfn/LGA/Qfp-IC pictures & photos

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What is Pau1115-153 OEM High Efficiency ISO Approved Precision Chip Sorting Equipment Semiconductor Industry Machine Chip-BGA/Qfn/LGA/Qfp-IC

Name: Pau1115-153 OEM High Efficiency ISO Approved Precision Chip Sorting Equipment Semiconductor Industry Machine Chip-BGA/Qfn/LGA/Qfp-IC
Uploaded: 2024-03-08T18:26:58+08:00
Description: Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automat

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$5,000.00-250,000.00 / Piece

Sepcifications

Function High Efficiency
Condition New
Certification RoHS, ISO
Warranty 12 Months
Automatic Grade Automatic
Installation Ground
Driven Type Electric
Transport Package Wooden Box
Specification 2700*1750*1800mm
Trademark PENGCHENG
Origin China
Machine Weight 2000 Kg
Size of Burn-in Board (Bib) 450*570 mm
Tray Model Jedec
Operating System Windows 10
Suitable for Various Chips

Product Description

Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast connection between the front-end and back-end of chip burn-in. It avoids the ...

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Pengcheng Intelligent Equipment Co., Ltd.

Diamond Member Since 2024

Audited Supplier

Business Type Group Corporation
Main Products PCBA Surface Inspection Machine, PCB/PCBA Online Cutting Machine, PCB/PCBA Offline Cutting Machine, Large Size PCB/PCBA Online Cutting Machine, Small Size PCB/PCBA Online Cutting Machine, PCB/PCBA Online Cutting and Sorting Machine, Tim Mounting Machine, Screw Locking Machine, Chip Intelligent Sorting Machine, CCD Visual Detection Module
Registered Capital 100000000 RMB
Plant Area 15000 square meters
Management System Certification ISO 9001, ISO 14001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month

Various Chips Comparison

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Transaction Info
	Quick View Pau1115-153 OEM High Efficiency ISO Approved Precision Chip Sorting Equipment Semiconductor Industry Machine Chip-BGA/Qfn/LGA/Qfp-IC Contact Now	Quick View Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine for RFID IC/to Package Contact Now	Quick View Shengdian SMT PCB Loader Machine Vacuum Suction Loader for LED/Big Bare Board Contact Now	Quick View Bzw-6f Hexagon Shape Die Set Terminal Crimping Machine Contact Now	Quick View Auto Deep Access Wire Ball Bonder Wire Bonding Machine Contact Now
Price	US $ 5,000.00-250,000.00/ Piece	US $ 72,000.00-150,000.00/ Piece	US $ 1,985.00-2,100.00/ Set	US $ 4,640.00-6,090.00/ SET	US $ 72,000.00-150,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Set	1 SET	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Paypal	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	RoHS, ISO	CE	CE	CCC, ISO, CE	CE
Management System Certification	ISO 9001, ISO 14001	-	-	ISO 9001	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	Own Brand	-	OEM, Own Brand	Own Brand
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Function: High Efficiency; Condition: New; Warranty: 12 Months; Automatic Grade: Automatic; Installation: Ground; Driven Type: Electric; Machine Weight: 2000 Kg; Size of Burn-in Board (Bib): 450570 mm;* Tray Model: Jedec; Operating System: Windows 10; Suitable for: Various Chips;	After-sales Service: 1 Year; Condition: New; Warranty: 12 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric;	After-sales Service: Online; Demoulding: No; Condition: New; Warranty: 1 Year; Automatic Grade: Automatic; Installation: No; Driven Type: Electric; Mould Life: No; PCB Size: 5050-500350mm; Machine Size: 60010501250mm; Gross Weight: 250kg; Power Supply: AC 220V; Air Supply: 0.4-0.6MPa;	Condition: New; Warranty: 24 Months; Automatic Grade: Semiautomatic; Driven Type: Electric; Crimping Shape: Hexagonal; Mode: Bzw-6f; Applicator: Universal Mode; Weight: 160 Kg;	After-sales Service: 1 Year; Condition: New; Warranty: 12 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric;
Supplier Name	Pengcheng Intelligent Equipment Co., Ltd.	Guangzhou Minder-Hightech co.,Ltd	Shenzhen Shengdian Electronic Equipment Co., Ltd.	Jiangsu Bozhiwang Automation Equipment Co., Ltd.	Guangzhou Minder-Hightech co.,Ltd
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