Embedded Computer Compute Module 3 Plus Cm3+16g Raspberry Pi Boards

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$20.00-100.00 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Single-Layer
  • Base Material PCB
  • Certification RoHS, CCC
  • Customized Non-Customized
  • Condition New
  • Transport Package Paper Box
  • Specification 1 piece/box
  • Trademark CENTURY SOLUTIONS
  • Origin GB
  • RAM 1GB Lpddr2 Sdram
  • Emmc 16GB
  • Processor Broadcom Bcm2837b0
  • Other Cortex-A53 (Armv8) 64-Bit Soc @ 1.2GHz
  • Application IoT/Ai

Product Description

Raspberry Pi Compute Module 3+ (CM3+) The Compute Module 3+ (CM3+) is a Raspberry Pi 3 Model B+ in a flexible form factor, intended for industrial applications. Specification The CM3+ Compute Module contains the guts of a Raspberry Pi 3 Model B+ (the BCM2837 processor and 1GB RAM) ...

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Raspberry Pi Comparison
Transaction Info
Price US $ 20.00-100.00/ Piece US $ 1.00-12.80/ Piece US $ 1.00-3.60/ Piece US $ 1.00-18.80/ Piece US $ 1.00-22.80/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, CCC RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025
Trade Capacity
Export Markets North America, Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
RAM: 1GB Lpddr2 Sdram;
Emmc: 16GB;
Processor: Broadcom Bcm2837b0;
Other: Cortex-A53 (Armv8) 64-Bit Soc @ 1.2GHz;
Application: IoT/Ai;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Supplier Name

CENTURY SOLUTIONS LIMITED

China Supplier - Gold Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier