Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Cl;
Layer: 24L;
Service: OEM/ODM, EMS;
Support: Fast Proofing;
MOQ: a Slice;
Ten Years: Export Trade Experience;
Sales Model: Factory Direct;
Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme;
Surface Finishing: HASL, Immersion Gold, OSP;
Application Field: LED, Medical, Industrial, Control Board;
Export Trade: More Than 10 Years;
Lndustry Experience: Over 30 Years;
Business Team Services: 7*24 Hours Online;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3mil/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr-4/Htg150-180 Fr-4/Cem-1/Cem-3/Aluminum;
Board Thickness: 0.2mm--4.0mm;
Minimum Trace Width: 3mil;
Min Space Width: 4mil;
Min Drilling Dia: 0.2mm;
Pth Copper Thickness: 0.4-2mil(10-50um);
Tolerance of Eteching: ± 1mil(± 25um);
Surface Finish/Plating: HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gol;
Tg Value: 130, 135, 140, 150, 170, 180;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3mil/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
PCB Testing: E-Testing; Flying Probe Testing;
Shipping: DHL, UPS, TNT, FedEx, etc;
|