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US$0.15-9.98 / Piece

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What is Professional Custom PCB Board Manufacturing Reliable Supplier of High-Performance Printed Circuit Board Solutions

Name: Professional Custom PCB Board Manufacturing Reliable Supplier of High-Performance Printed Circuit Board Solutions
Uploaded: 2023-09-13T17:56:58+08:00
Description: PCB Item Manufacture Capacity Layer Counts 1L-40L Min Hole Size(mechanical) 0.15mm Base Material NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic Min Hole Size(laser hole) 0.

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Price

Min. Order Reference FOB Price

1 Piece US$0.15-9.98 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Chenlu
Transport Package Vacuum Packing
Specification 150*120mm
Trademark CHENLU CIRCUITS
Origin China
Min Annular Ring 0.05mm/0.05mm
Layer Counts 1L-40L
HASL/Lf Hal 2.5um
Copper Weight 0.5--6 Oz

Product Description

PCB Item Manufacture Capacity Layer Counts 1L-40L Min Hole Size(mechanical) 0.15mm Base Material NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic Min Hole Size(laser hole) 0.1mm FPC Material Dupont,Taiflex,SYL,Thinflex Hole Size Tol (+/-) PTH:+0.075mm; ...

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Dongguan Chenlu Electronics Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Instruments & Meters
Main Products PCB Board, PCBA, PCB Assembly, MP3, Printed Circuit, Printed Wiring, Printed Circuit Board, Printed Board Assembly, Double-Sided Printed Board
Registered Capital 1000000 RMB
Plant Area 1001~2000 square meters

PCB Comparison

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Transaction Info
	Quick View Professional Custom PCB Board Manufacturing Reliable Supplier of High-Performance Printed Circuit Board Solutions Contact Now	Quick View Prototype PCB Board Manufacturer Impedance Board Immersion Gold Contact Now	Quick View Tu872+R4350 Material Hybrid Board 2.4mm Thickness Depth Milling Process Electric Gold Finger Fr4 Multilayer PCB Contact Now	Quick View Gold Plating Surface Rogers 4350+Fr-4 Mix Press Stack up Buried Holes Multi Layer in PCB with 622*1200mm Biggest Size Contact Now	Quick View Anti-Oxidation Surface Treatment HTC High Speed PCB Material 0.1mm Laser Hole Multilayer PCB Manufacturing Contact Now
Price	US $ 0.15-9.98/ Piece	US $ 0.10-20.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Management System Certification	-	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485	-	-	-
Trade Capacity
Export Markets	-	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	-	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	-	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu; Min Annular Ring: 0.05mm/0.05mm; Layer Counts: 1L-40L; HASL/Lf Hal: 2.5um; Copper Weight: 0.5--6 Oz;	Type: Rigid Circuit Board; Material: Fr4-Kb; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Hl-PCB; Surface Treatment: Immersion Au; Mini Hole Diameter: 0.25mm; Borad Thickness: 1.6mm; Count Layer: 6; Inner/Outer Copper Thickness: 1oz/1oz; Min Trace Width/Spacing: 5mil/5mil; Special: Impedance Board; Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;
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