Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hongzhou;
PCBA-Testing: X-ray, Aoi;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hongzhou;
PCBA-Testing: X-ray, Aoi;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.25mm;
Borad Thickness: 1.6mm;
Count Layer: 6;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special: High Tg, Impedance Control, Resin Plug Vias;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Lead Free HASL;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: High Tg, Impedance Control, Resin Plug Vias;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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